Introducing our newly shipped PCB based on Rogers' RO3035 laminates, a ceramic-filled, PTFE-based high-frequency circuit material. These laminates are part of the RO3000 series and have been specifically developed to meet the demands of 5G, millimeter wave sub 6GHz, and massive MiMo applications. With its exceptional features and benefits, this PCB is an ideal choice for various cutting-edge technologies.

Key Features:

Rogers RO3035 Ceramic-Filled PTFE Composites: This PCB utilizes high-quality RO3035 laminates known for their excellent mechanical properties and high-frequency performance. These ceramic-filled PTFE composites ensure reliable signal transmission and stability in multi-layer board designs.

Impressive Electrical Properties: The RO3035 material exhibits a dielectric constant (Dk) of 3.5+/- 0.05 at 10 GHz/23°C, providing precise signal integrity. It also has a low dissipation factor of 0.0015 at 10 GHz/23°C, minimizing signal loss. These properties make it well-suited for high-frequency applications up to 30-40 GHz.

Thermal Stability and Dimensional Reliability: RO3035 substrate offers a thermal decomposition temperature (Td) exceeding 500°C, ensuring excellent thermal stability. It also features a low coefficient of thermal expansion (CTE) in the range of -55 to 288 °C (X axis: 17 ppm/°C, Y axis: 17 ppm/°C, Z axis: 24 ppm/°C), providing dimensional stability and reliability. This makes it suitable for applications sensitive to temperature changes.

Benefits for Multi-Layer Board Designs: The PCB's uniform mechanical properties across a range of dielectric constants enable it to be used in multi-layer board designs without warping or decreased reliability. It is compatible with epoxy glass multi-layer board hybrid designs, offering flexibility and versatility.

PCB Construction Details: This 2-layer rigid PCB features two copper layers, each 35 μm thick. The RO3035 substrate has a thickness of 30mil (0.762mm), providing a sturdy foundation for the circuitry. The finished board thickness is 0.8mm, with a finished copper weight of 1 oz (1.4 mils) on the outer layers. The via plating thickness is 20 μm, ensuring robust electrical connections. The surface finish is Immersion Gold, providing excellent solderability and corrosion resistance.

PCB Statistics: This PCB includes 36 components and a total of 92 pads, including 62 thru-hole pads and 30 top surface mount technology (SMT) pads. It features 53 vias and 5 nets, allowing efficient electrical connectivity. The board dimensions are 231.94mm x 135.65mm, providing ample space for the circuitry.

Quality Standards and Availability: The PCB adheres to the IPC-Class-2 quality standard, ensuring high-quality and reliability. It is available worldwide, enabling engineers and designers from various regions to access this advanced product.

Typical Applications: This PCB based on RO3035 laminates is well-suited for a range of applications requiring high-frequency performance and thermal stability. Some typical applications include automotive radar systems, global positioning satellite antennas, cellular telecommunications systems (power amplifiers and antennas), wireless communication patch antennas, direct broadcast satellites, datalink on cable systems, remote meter readers, and power backplanes.

To summarize, our newly shipped PCB, built with RO3035 laminates, offers unparalleled performance, stability, and reliability, catering specifically to high-frequency applications. With its advanced features, precise manufacturing, and adherence to industry standards, this PCB is an ideal choice for demanding electronic systems. Whether you're working on automotive radar, satellite communications, or wireless technologies, this PCB provides exceptional performance and capabilities. Don't miss out on the opportunity to experience the reliability and efficiency of our RO3035-based PCB. It is readily available worldwide, ensuring easy access and convenience for customers across the globe.