Specifications
Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Supply Ability :
5000PCS per month
Delivery Time :
8-9 working days
Packaging Details :
Vacuum bags+Cartons
Description

Introducing our newly shipped PCB. This high-quality product is designed to meet the demands of various applications, offering exceptional performance and reliability.

The PCB substrates are constructed using Rogers RT/duroid 5880, a glass microfiber reinforced PTFE composite material. With a process DK of 2.2 +/- 0.02 at 10 GHz/23°C, it ensures excellent electrical performance. The low dissipation factor of 0.0009 at the same frequency and temperature minimizes electrical loss. The material exhibits a high decomposition temperature (Td) exceeding 500°C, providing stability even in high-temperature environments. Additionally, its moisture absorption rate of 0.02% enables reliable performance in high-moisture conditions. The isotropic properties of the material ensure uniform electrical characteristics. The PCB operates within a temperature range of -40℃ to +85℃.

Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009
Z N/A C24/23/50
C24/23/50
1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)
N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237
X
Y
Z
ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float
IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

Our PCB offers several benefits. It boasts the lowest electrical loss compared to other reinforced PTFE materials. It can be easily cut, shaped, and machined to meet specific requirements. The material is resistant to solvents and reagents used in etching or plating edges and holes, ensuring durability and longevity. It is ideal for applications in high-moisture environments. Furthermore, this material has a well-established track record of reliability. It maintains uniform electrical properties over a wide frequency range.

The stackup of this PCB consists of a 2-layer rigid construction. It features a copper_layer_1 with a thickness of 35 μm followed by a Rogers Core RT/duroid 5880 with a thickness of 0.254 mm (10 mil), and finally, a copper_layer_2 with a thickness of 35 μm.

0.3mm RT Duroid 5880 PCB Immersion Gold IPC Class 2 Standard

The construction details of the PCB are as follows: The board dimensions are 139.61mm x 37.96 mm (1PCS), with a tolerance of +/- 0.15mm. It has a minimum trace/space of 5/4 mils and a minimum hole size of 0.2mm. The PCB does not have any blind vias, simplifying the manufacturing process. The finished board thickness is 0.3mm, striking a balance between durability and lightweight design. The outer layers have a finished copper weight of 1oz (1.4 mils). The via plating thickness measures 20 μm, ensuring robust connections. The surface finish is Immersion Gold, providing excellent conductivity and corrosion resistance. The PCB does not have top or bottom silkscreen or solder mask layers. Prior to shipment, each PCB undergoes a comprehensive 100% electrical test to ensure its reliability and adherence to quality standards.

The PCB statistics demonstrate its versatility. It accommodates a total of 9 components and 16 pads, with 16 top surface mount technology (SMT) pads and no thru-hole pads or bottom SMT pads. There are no vias, and it features a single net. The artwork is supplied in Gerber RS-274-X format, compatible with standard manufacturing processes.

Our PCB complies with the IPC-Class-2 standard, ensuring consistent performance and durability. It is available worldwide, offering global accessibility to customers. Its exceptional performance makes it suitable for various applications, including commercial airline broadband antennas, microstrip and stripline circuits, millimeter wave applications, radar systems, guidance systems, and point-to-point digital radio antennas.

For any technical inquiries or further information, please do not hesitate to contact our dedicated team at sales10@bichengpcb.com. Our commitment is to provide exceptional support and ensure your satisfaction with our products.

0.3mm RT Duroid 5880 PCB Immersion Gold IPC Class 2 Standard

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0.3mm RT Duroid 5880 PCB Immersion Gold IPC Class 2 Standard

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Brand Name :
Bicheng
Certification :
UL, ISO9001, IATF16949
Place of Origin :
CHINA
MOQ :
1PCS
Price :
USD9.99-99.99/PCS
Payment Terms :
T/T
Contact Supplier
0.3mm RT Duroid 5880 PCB Immersion Gold IPC Class 2 Standard
0.3mm RT Duroid 5880 PCB Immersion Gold IPC Class 2 Standard

Bicheng Electronics Technology Co., Ltd

Verified Supplier
5 Years
guangdong, shenzhen
Since 2003
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Seller
Total Annual :
10 million-18 million
Employee Number :
350~450
Certification Level :
Verified Supplier
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