Resin Bond Diamond Cutting Wheel

The Resin Bond Diamond Cutting Wheel is engineered for precision cutting of non-metal and non-ferrous materials. Utilizing high-quality synthetic diamond abrasives bonded with a specialized resin matrix, this cutting wheel delivers exceptional cutting performance with minimal chipping and excellent edge quality.

Key Applications

• Glass Cutting: Optical glass, float glass, tempered glass, and display glass panels
• Quartz Cutting: Quartz crystal, fused silica, and quartz glass tubing
• LED Substrate Cutting: Sapphire wafers, silicon carbide (SiC), and gallium nitride (GaN) substrates
• Ceramic Cutting: Alumina (Al₂O₃), zirconia (ZrO₂), and silicon nitride (Si₃N₄) ceramics
• Cemented Carbide: Tungsten carbide (WC-Co) rods, inserts, and wear parts
• Composite Materials: Carbon fiber reinforced polymer (CFRP) and glass fiber reinforced polymer (GFRP)

Performance Advantages

• Superior cutting sharpness with minimal burr formation and clean cut edges
• Low cutting force reduces material stress and prevents micro-cracking on brittle materials
• Excellent heat dissipation characteristics for extended continuous operation
• Consistent cutting quality maintained across the full service life of the wheel
• Available in various grit sizes and diamond concentrations for specific material requirements

Technical Specifications

Our resin bond diamond cutting wheels are available in diameters from 100mm to 400mm, with thickness ranging from 0.3mm to 3.0mm. Standard diamond grit sizes include D64, D91, D126, D151, and D181. Custom dimensions, grit sizes, and concentrations are available upon request to meet specific application requirements.

Quality Assurance

Each wheel undergoes rigorous quality inspection including dimensional accuracy verification, dynamic balance testing, and cutting performance evaluation. Manufactured in an ISO 9001:2015 certified facility with full material traceability and batch documentation.