Low-Molecular-Weight Polyamide Resin for Epoxy Coatings & Flooring
SE-5703B is a high-viscosity, low-molecular-weight polyamide resin diluted with xylene. It is used as a curing agent for epoxy resins and is widely applied in the preparation of room-temperature-curing solvent-based epoxy resin coatings, heavy-duty anti-corrosion coatings, floor paints (epoxy flooring), and adhesives. It features relatively low viscosity for easy handling. When combined with epoxy resin, the resulting coating exhibits good adhesion, excellent flexibility, long pot life, and outstanding overall performance.