Communication System PCBA BGA QFN Assembly
PCBA Capability
SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB Assembly Services. Compliant with a wide range of standards including IPC 610 Class 2 and Class 3.
The main SMT production line consists of automated high-precision state-of-the-art equipments from PanasonIC,Sumsung, Japan total 6 lines (Smallest SMT components size can reach to 0201,capable of 0.6mm*0.3mm ~ 50mm*50mmQFP, 0.15mm gap, ±0.05 accuracy ),
 EMS capacity can reach 150,000,000 components per month.
Our engineering team has extensive experience in DFM/DFA/DFT technologies.
 SMT, BGA Rework, Re-balling, X-Ray are all readily achieveable. Stencils can
 be cut and delivered inside of 4 hours.
|  			 Order Conditions  			 |  			 			 Standard Delivery Date  			 |  			 			 The fastest Delivery Date  			 |  		
|  			 Prototype ( <20pcs)  			 |  			 			 2days  			 |  			 			 8hours  			 |  		
|  			 Small Volume (20-100pcs)  			 |  			 			 6days  			 |  			 			 12hours  			 |  		
|  			 Medium Volume (100-1000)  			 |  			 			 3days  			 |  			 			 24hours  			 |  		
|  			 Mass Production (>1000)  			 |  			 			 Depends on BOM  			 |  			 			 Depends on BOM  			 |  		
