1. Ultra-High Purity – Zero Metal Contamination

• SiO₂ purity ≥ 99.99%, premium grades up to 99.995%
• Extremely low metal ion content (Na/K/Fe etc. < 1ppm)
• No precipitation, volatilization or particle shedding at high temperatures
• The first line of defense for wafer yield — metal contamination directly causes device failure

2. Extreme Heat Resistance – Wide Process Compatibility

• Continuous service temperature 1200°C, higher for short periods
• Softening point approx. 1700°C — no softening or deformation at high temperatures
• Compatible with mainstream high-temperature processes: diffusion, oxidation, annealing, LPCVD

3. Precision-Machined Slots – Accurate, Reliable Wafer Loading

• Slot pitch tolerance ±0.1mm with strict slot width tolerance
• Slot parallelism < 0.1mm
• Wafer placement angle 88°±0.5° (near-vertical for uniform gas and heat exposure)
• Precise slots ensure identical thermal and gas conditions for every wafer

4. Ultra-Low Thermal Expansion – Superior Thermal Shock Resistance

• Thermal expansion coefficient of only 5.5×10⁻⁷/°C (near-zero expansion)
• Outstanding thermal shock resistance — no cracking under frequent heating/cooling cycles
• Dimensionally stable after repeated thermal cycling — no warping or deformation

5. Strong Corrosion Resistance – Chemical Inertness

• Resists strong acids (except HF) and most process atmospheres
• No reaction with chlorine, oxygen, dopant gases etc. at high temperatures
• Resists erosion and deposit buildup — long service life

6. High Electrical Insulation – Safe & Reliable

• High resistivity (approx. 7×10⁷ Ω·cm)
• Maintains excellent insulation performance at high temperatures
• Eliminates leakage interference for process safety

7. Versatile Structures – Compatible with Various Furnace Types

• Horizontal boats (for horizontal furnaces) and vertical boats (for vertical furnaces)
• Single-wafer / multi-wafer boats (25/50/100 slot options)
• Compatible with 4", 6", 8", 12" (100/150/200/300mm) wafers
• Slot count, pitch and profile deeply customizable per drawings

8. Low Particle Generation – Clean Process Assurance

• Finely treated surface — smooth and burr-free
• Effectively reduces particle generation and residue
• Suitable for cleanroom process environments