Factory Direct Supply Ivory-White 100% Solid Reactive PUR Hot Melt Adhesive WANLI® PUR-8830 with Open Time 3~5 Minutes at 25℃ for Electrical Structural Bonding, Perfect Bonding Strength

Wanli® PUR hot melt adhesive PUR-8830 for electronics structural bonding is a single-component reactive PUR hot melt adhesive with 100% solid content. It can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. It is featured stable viscosity under heating at a certain temperature, high initial bonding strength and final bonding strength. After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance. It is especially suitable for bonding applications in the electronic industry.

APPLICATION

Wanli® PUR hot melt adhesive PUR-8830 is used for electronics structural bonding. It can be used for self-adhesion and mutual adhesion of PC, ABS, PVC and other plastics and aluminum, stainless steel and other metals. It is especially suitable for bonding applications in the electronic industry.

FEATURE

Stable viscosity under heating at a certain temperature.

High initial bonding strength and final bonding strength.

After curing, it has good peeling strength, good heat&humidity resistance and chemical resistance.

USER GUIDE

The package of PUR-8830 is suitable for various dispensing equipment. The recommended operating temperature is about 110℃. In order to achieve complete curing, it is better to place finished product in a working environment with suitable temperature and humidity (recommended temperature: 23~25℃, about 65% relative humidity).

STORAGE

Store the product where it’s dry, cool and avoid direct sunlight. The storage temperature should be no more than 35℃ and avoid open fire or heat source.