DVR Power Module 2 Layers Lead-Free Hot Air Solder Leveling SMT PCB Assembly OEM ODM Printed Circuit Board

Lead-Free Hot Air Solder Leveling process of PCB

PCB process requirements are a very important factor, he directly determines the quality and positioning of the PCB board, such as tin spraying, gold plating, gold plating, relatively speaking, gold plating is the face of high-end printed circuit boards, gold plating due to good quality, relative to the cost is relatively high, so many customers choose the most commonly used tin spraying process, many people know the spray
Tin process, but do not know that tin is also divided into lead tin and lead-free tin two, with white paper on the solder pad tin point of the PCB circuit board wipe down, the white paper change color is lead, do not change color is lead-free.

What equipment is used in SMT PCB Assembly?

In general, the following equipment is suitable for SMT assembly: tin printing press, patch machine, reflow furnace, AO (Automatic Optical Inspection) instrument, magnifying glass or microscope, etc.

SMT PCB Assembly Specification

SMT PCB Assembly Manufacturer

Shenzhen SKY-WIN Technology Co., Ltd was founded in February 2015, focusing on PCBA OEM/ODM one-stop service, solution customization, SMT patch, DIP plug-in, functional testing, assembly and other OEM/ODM services.

SMT PCB Assembly Inspection Necessity

In order to ensure the quality and performance of the assembled PCB, it is very necessary to check during the entire SMT assembly process. Multiple types of inspections must be used to reveal manufacturing defects, which can reduce the reliability of the final product.

Visual inspection is most commonly used in SMT patch assembly. As a direct inspection method, visual inspection can be used to indicate obvious physical errors, such as component displacement, missing components, or component irregularity.

Visual inspection is not suitable for visual inspection. Tools such as a magnifying glass or microscope can also be used. In order to further point out the defects occurring in the welding ball, AOI and X-ray inspection can be used after the completion of coal bonding

SMT PCB Assembly Case