DIP/SMT PCB Assembly Lead-Free Hot Air Solder Leveling PCB 2 Layers Electronic Circuit Board

Advantages of SMT

It has a high assembly density, making electronic devices lighter in weight
It has high vibration resistance
SMT ignore reliable
Less solder joint error
SMT has high frequency reduction for electromagnetic and RF reduction
It saves on equipment costs

SMT PCB Assembly Specification

SMT PCB Assembly Processing Technology requirements for PCB Design
In the process of SMT patch processing, all processing equipment has the characteristics of full automation, precision and speed. Then the PCB design must meet the requirements of SMT patch processing equipment in order to effectively guarantee product quality.

1. PCB shape design
2. PCB size design
3. PCB thickness design
4. PCB process side design
5. PCB component layout design
6. PCB Pad Design

Lead-Free Hot air solder leveling For SMT PCB Assembly

SMT PCB assembly process requirements are a very important factor in circuit board production, which directly determines the quality and positioning of a board.

For example, PCB Assembly HASL and immersion gold, relatively speaking, immersion gold is for high-end boards. Due to the good quality of immersion gold, it is relatively high relative to the cost.
Therefore, many customers choose the most commonly used Lead-Free Hot air solder leveling
Lead-free tin-spraying of PCB boards is environmentally friendly and does not contain harmful substance "lead", with a melting point of about 218 degrees; the temperature of the tin-spraying tin furnace needs to be controlled at 280-300 degrees; -270 degrees.

SMT PCB Assembly Manufacturer

Shenzhen SKY-WIN Technology Co., Ltd which is one-stop PCBA intelligent manufacturing platform, sample/small batch, SMT patch, PCB proofing, DIP welding processing, PCB board making, full set of electronic components purchasing, one-stop PCBA manufacturing services.