PRODUCT’S DETAILS

Raw Material

FR-4 (Tg 180 available)

Layer Count

4-Layer

Board Thickness

1.6 mm

Copper Thickness

1.0 oz

Surface Finish

ENIG/ Immersion Gold

Solder Mask

Green

Silkscreen

White

Min. Trace Width/Spacing

0.075/0.075mm

Min. Hole Size

0.25mm

Hole Wall Copper Thickness

≥20μm

Measurement

300×400mm

Packaging

Inner: Vacuum-packed in soft plastic bales
Outer: Cardboard Cartons with double straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug,
BGA Soldering And Gold Finger Are Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB

Process Engineering

Items

Manufacturing Capability

Laminate

Thickness

0.2～3.2mm

Production Type

Layer Count

2L-16L

Cut Lamination

Max. Working Panel size

1000×1200mm

Inner Layer

Internal Core Thickness

0.1～2.0mm

Internal width/spacing

Min: 4/4mil

Internal Copper Thickness

1.0~3.0oz

Dimension

Board Thickness Tolerance

±10%

Interlayer Alignment

±3mil

Drilling

Manufacture Panel Size

Max: 650×560mm

Drilling Diameter

≧0.25mm

Hole Diameter Tolerance

±0.05mm

Hole Position Tolerance

±0.076mm

Min.Annular Ring

0.05mm

PTH+Panel Plating

Hole Wall copper Thickness

≧20um

Uniformity

≧90%

Outer Layer

Track Width

Min: 0.08mm

Track Spacing

Min: 0.08mm

Pattern Plating

Finished Copper Thickness

1oz～3oz

EING/Flash Gold

Nickel Thickness

2.5um~5.0um

Gold Thickness

0.03~0.05um

Solder Mask

Thickness

15～35um

Solder Mask Bridge

3mil

Legend

Line width/Line spacing

6/6mil

Gold Finger

Nickel Thickness

≧120u〞

Gold Thickness

1～50u〞

Hot Air Level

Tin Thickness

100～300u〞

Routing

Tolerance of Dimension

±0.1mm

Slot Size

Min:0.4mm

Cutter Diameter

0.8～2.4mm

Punching

Outline Tolerance

±0.1mm

Slot Size

Min:0.5mm

V-CUT

V-CUT Dimension

Min:60mm

Angle

15°30°45°

Remain Thickness Tolerance

±0.1mm

Beveling

Beveling Dimension

30～300mm

Test

Testing Voltage

250V

Max.Dimension

540×400mm

Impedance Control

Tolerance

±10%

Aspect Ration

12:1

Laser Drilling Size

4mil(0.1mm)