Product Description

This is a fully integrated SMT surface mount production line that combines core equipment such as high-speed pick-and-place machines, intelligent reflow ovens, and automatic transfer stations to achieve automated operations from component feeding to PCB assembly. Featuring a modular design, the equipment adapts to diverse electronic component placement and soldering requirements, serving as the core production unit for electronics manufacturing facilities.

Product advantages

Efficiency Enhancement & Cost Reduction: Full-process automation reduces manual intervention by 80%, boosts single-shift production capacity by 40%, and lowers unit production cost by 15%;
High Compatibility: Supports PCBs ranging from 50×50mm to 400×300mm, accommodating diverse products including consumer electronics and automotive electronics;
Low Maintenance Burden: Equipment MTBF (Mean Time Between Failures) ≥5000 hours, with 80% commonality in wear parts, resulting in minimal maintenance costs.

Translated with DeepL.com (free version)

Product features

High-Precision Placement: The placement machine features a vision positioning system, supporting placement from 0201 micro-components to BGA chips with ±0.02mm accuracy and a placement speed of 12,000 points per hour;
Intelligent Temperature-Controlled Soldering: The reflow oven features 8 independent temperature-control zones, enabling precise heating/cooling rates and compatibility with lead-free solder processes.
Fully Automated Integration: The transfer station automatically adapts to PCB dimensions, ensuring seamless connection with upstream/downstream equipment—eliminating manual handling throughout the entire process.

Translated with DeepL.com (free version)

Application scenarios
Suitable for batch electronic component assembly production scenarios such as mobile phone motherboards, tablet circuit modules, automotive sensor PCBs, and industrial control circuit boards.