PCB Assemlby services including:
* Electronic Design Engineering
 * PCB Design and Layout
 * Complete PCB Fabrication
 * Custom & High Temp materials
 * BGA/LGA, Blind/Buried Vias, Controlled Impedance, Differential Pairs
 * Production and Inventory Control
 * Turn-key Parts Procurement, Assembly 
 * Testing & Packaging Services
 * Quality Electronic/Electro-Mechanical Assembly.
 * ESD Safety
 * Process Routing - Specific for each job
 * ROHS Compliance 
 
 * Complete Document Control:
 - Engineering Change Order
 - Serialization of Assemblies & Cables for Tracking
 - Modification Procedure
 - Revision Control/Prints
 - Deviation Forms
 
 * Surface Mount Technology
 * Mixed Technology Board Assemblies
 * Rework & Handwiring
Detailed Specification of PCB Manufacturing
|  			 1  |  			 			 layer  |  			 			 1-30 layer  |  		
|  			 2  |  			 			 Material  |  			 			 CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.  |  		
|  			 3  |  			 			 Board thickness  |  			 			 0.2mm-6mm  |  		
|  			 4  |  			 			 Max.finished board size  |  			 			 800*508mm  |  		
|  			 5  |  			 			 Min.drilled hole size  |  			 			 0.25mm  |  		
|  			 6  |  			 			 min.line width  |  			 			 0.075mm(3mil)  |  		
|  			 7  |  			 			 min.line spacing  |  			 			 0.075mm(3mil)  |  		
|  			 8  |  			 			 Surface finish  |  			 			 HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP  |  		
|  			 9  |  			 			 Copper thickness  |  			 			 0.5-4.0oz  |  		
|  			 10  |  			 			 Solder mask color  |  			 			 green/black/white/red/blue/yellow  |  		
|  			 11  |  			 			 Inner packing  |  			 			 Vacuum packing,Plastic bag  |  		
|  			 12  |  			 			 Outer packing  |  			 			 standard carton packing  |  		
|  			 13  |  			 			 Hole tolerance  |  			 			 PTH:±0.076,NTPH:±0.05  |  		
|  			 14  |  			 			 Certificate  |  			 			 UL,ISO9001,ISO14001,ROHS,TS16949  |  		
|  			 15  |  			 			 Profiling punching  |  			 			 Routing,V-CUT,Beveling  |  		
Detailed Specification of Pcb Assembly
|  			 1  |  			 			 Type of Assembly  |  			 			 SMT and Thru-hole  |  		
|  			 2  |  			 			 Solder Type  |  			 			 Water Soluble Solder Paste,Leaded and Lead-Free  |  		
|  			 3  |  			 			 Components  |  			 			 Passives Down to 0201 Size  |  		
|  			 BGA and VFBGA  |  		||
|  			 Leadless Chip Carries/CSP  |  		||
|  			 Double-Sided SMT Assembly  |  		||
|  			 Fine Pitch to 08 Mils  |  		||
|  			 BGA Repair and Reball  |  		||
|  			 Part Removal and Replacement-Same Day Service  |  		||
|  			 3  |  			 			 Bare Board Size  |  			 			 Smallest:0.25x0.25 Inches  |  		
|  			 Largest:20x20 Inches  |  		||
|  			 4  |  			 			 File Formats  |  			 			 Bill of Materials  |  		
|  			 Gerber Files  |  		||
|  			 Pick-N-Place File(XYRS)  |  		||
|  			 5  |  			 			 Type of Service  |  			 			 Turn-Key,Partial Turn-Key or Consignment  |  		
|  			 6  |  			 			 Component Packaging  |  			 			 Cut Tape  |  		
|  			 Tube  |  		||
|  			 Reels  |  		||
|  			 Loose Parts  |  		||
|  			 7  |  			 			 Turn Time  |  			 			 15 to 20 days  |  		
|  			 8  |  			 			 Testing  |  			 			 AOI inspection  |  		
|  			 X-Ray inspection  |  		||
|  			 In-Circuit testing  |  		||
|  			 Functional test  |  		
Quality Assurance: 
  
 Our Quality processes include: 
 1. IQC: Incoming Quality Control (Incoming Materials Inspection)
 2. First Article Inspection for every process 
 3. IPQC: In Process Quality Control
 4. QC: 100% Test & Inspection
 5. QA: Quality Assurance based on QC inspection again
 6. Workmanship: IPC-A-610, ESD
 7. Quality Management based on CQC, ISO9001:2008
Factory view:
