Zirconia Ceramic Wafer Carriers And Cleaning Jigs: Precision Support Solutions For Semiconductor And Photovoltaic Industries

Introduction

Zirconia ceramic wafer carriers and cleaning jigs are high-precision auxiliary tools specifically designed for semiconductor wafer manufacturing and photovoltaic silicon processing. Manufactured from high-purity, nano-grade zirconia (ZrO₂) through phase transformation toughening technology and precision machining, they exhibit exceptional dimensional stability, excellent chemical corrosion resistance, and outstanding mechanical strength. These components operate reliably in high-temperature, highly corrosive, and ultra-clean environments, ensuring zero contamination and zero damage support for wafers and silicon sheets during manufacturing processes.

Applications

• Semiconductor Wafer Manufacturing: Diffusion process boats, CVD trays, etching fixtures, ion implantation carriers

• Photovoltaic Silicon Processing: Cleaning baskets, texturing supports, PECVD trays, screen printing positioning jigs

• Display Panel Manufacturing: OLED evaporation mask supports, glass substrate transfer arms

• Precision Testing Equipment: Probe station chucks, microscope stages, thickness measurement tooling

Advantages

1. Ultra-High Dimensional Stability: Thermal expansion coefficient close to silicon (4.2×10⁻⁶/K), ensuring no displacement deviation during high-temperature processes

2. Excellent Chemical Resistance: Resists corrosion from all semiconductor-grade chemicals including HF, HNO₃, and KOH

3. Extremely Low Contamination Risk: Metal ion release <0.1ppb, meeting Class 10 cleanroom requirements

4. Exceptional Wear Life: Hardness >1300HV, service life exceeds PEEK materials by more than 10 times

5. Multi-functional Integration: Can incorporate special functional requirements such as conductivity, insulation, and magnetism

Specification Parameter Table

Nanoscale powder synthesis → Stabilizer doping → Spray granulation → Isostatic pressing → Pre-sintering → Five-axis precision machining → High-temperature sintering → Precision grinding → CMP polishing → Ultrasonic cleaning → Cleanroom packaging

Usage Instructions

• Requires plasma cleaning in a cleanroom before use to remove packaging contaminants

• Regular particle testing recommended for silicon contact areas (every 50 cycles)

• Avoid direct contact with hard tools; use dedicated ceramic tweezers for handling

• Store in ISO Class 4 or higher clean environments

After-Sales Service

Cleanroom unpacking guidance, usage training, free particle testing service, 12-month warranty period, emergency replacement support, and custom modification services

FAQ

Q1: What advantages do zirconia carriers offer over silicon carbide carriers?
A: Lower metal ion release risk (by one order of magnitude) and no silicon vapor contamination

Q2: Is RFID embedding integration supported?
A: Yes, high-temperature resistant RFID tags can be embedded, withstanding up to 800℃ process temperatures

Q3: How to perform daily maintenance?
A: Recommend O₃+H₂O₂ mixed cleaning every 50 uses and SPM deep cleaning every 200 uses