Ultra-High Thermal Conductivity Silicon Nitride Ceramics for Power Electronics and New Energy Vehicles

Silicon nitride (Si₃N₄) ceramic substrates are manufactured using 99.5% high-purity raw materials through tape casting and gas pressure sintering processes. The products exhibit excellent thermal conductivity, high strength and reliability, making them an ideal thermal management solution for next-generation high-power electronic devices.

Primary Applications

• Power electronics: IGBT, SiC power modules

• New energy vehicles: Motor controllers, OBC

• Rail transportation: Traction converters

• PV inverters: High-power photovoltaic modules

• 5G communications: Base station RF devices

Key Advantages

✓ Ultra-high thermal conductivity: ≥90W/(m·K)
✓ High strength & toughness: Flexural strength ≥600MPa
✓ Low thermal expansion: CTE 3.2×10⁻⁶/°C
✓ Excellent insulation: Volume resistivity >10¹⁴Ω·cm
✓ Superior reliability: Passes 1000 cycles of -40~150°C thermal shock test

Technical Specifications

Manufacturing Process

1. Material preparation: Nano-grade Si₃N₊ powder modification

2. Tape casting: Producing 0.1-1.2mm green tapes

3. Isostatic pressing: 200MPa densification

4. Gas pressure sintering: 1850°C/10MPa N₂ atmosphere

5. Precision machining: Laser cutting, drilling

6. Surface treatment: Double-side polishing to Ra≤0.2μm

Usage Guidelines

⚠️ Storage: Vacuum packed, moisture and dust proof
⚠️ Soldering: Recommended active metal brazing
⚠️ Mounting stress: Control <50MPa assembly stress
⚠️ Thermal design: Recommended with thermal grease

After-Sales Service

• Warranty: 36-month quality guarantee

• Technical support: Free thermal design consultation

• Testing service: Third-party test reports available

• Customization: Special sizes and structures

FAQ

Q: Advantages vs AlN substrates?
A: Main advantages:
① 3-5x higher strength
② Better thermal shock resistance
③ Higher reliability

Q: Maximum processable size?
A: Standard 200×200mm, special process up to 300×300mm.

Q: Recommended metallization?
A: Options include:
• DBC direct bonding copper
• AMB active metal brazing
• Thick film printing