Specifications
Place of Origin :
Made In China
Brand Name :
Dayoo
MOQ :
Negotiable
Price :
Negotiable
Delivery Time :
Negotiable
Payment Terms :
Negotiable
Properties :
electric insulation
Thermal Conductivity :
35 W/mK
Hardness :
9 Mohs
Alumina Content :
92% & 95%
Low Dielectric Loss :
0.0002
Melting Point :
2040°C
High Temperature Resistance :
Yes
Type :
ceramic ball
Color :
White
Size :
Customized
Manufacturing Method :
Dry Pressing or Isostatic Pressing
Coefficient Of Thermal Expansion :
8 x 10^-6/°C
Precision Tolerance :
High
Machinability :
Difficult
Compressive Strength :
2,000 MPa
Description

Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications

Product Overview

Alumina ceramic heat sink substrates are advanced electronic cooling materials manufactured from high-purity aluminum oxide (Al₂O₃). These substrates feature excellent thermal conductivity, electrical insulation, and mechanical strength. Utilizing cutting-edge ceramic processing technology, they offer superior surface flatness and thermal expansion coefficients that match semiconductor materials, making them ideal heat dissipation carriers for power electronic devices.

Key Applications

  • LED Lighting: Heat sinks for high-power LED chips

  • Power Electronics: IGBT modules and power semiconductor devices

  • Telecom Equipment: 5G base station power amplifiers

  • Automotive Electronics: New energy vehicle control systems

Product Advantages

  1. Exceptional Thermal Conductivity: 24-28W/(m·K)

  2. High Insulation Performance: Breakdown voltage >15kV/mm

  3. Low Thermal Expansion: Matches chip expansion (7.2×10⁻⁶/℃)

  4. High-Temperature Resistance: Continuous operation up to 1000℃

  5. Superior Mechanical Strength: Flexural strength >300MPa

Technical Specifications

Parameter Specification
Material Purity 96%/99% Al₂O₃ options
Thermal Conductivity 24-28W/(m·K)
Breakdown Voltage >15kV/mm
Surface Roughness Ra≤0.2μm
Thermal Expansion 7.2×10⁻⁶/℃(20-300℃)
Standard Sizes 50×50mm to 150×150mm
Thickness Range 0.3-3.0mm

Manufacturing Process

  1. Powder Preparation: Fine grinding of high-purity alumina

  2. Tape Casting: Producing high-precision green tapes

  3. High-Temp Sintering: 1600-1700℃ densification

  4. Precision Machining: Laser cutting, surface polishing

  5. Metallization: Screen printing/sputtering

  6. Quality Control: Thermal/insulation testing

Usage Guidelines

  1. Maintain clean surfaces during installation

  2. Use thermal paste for better heat transfer

  3. Avoid mechanical impacts to prevent cracking

  4. Regularly inspect surface conditions

Service Commitment

  • 18-month quality guarantee

  • Professional technical support

  • Rapid response to inquiries

  • Sample testing and small-batch customization

FAQ

Q: Advantages vs aluminum substrates?
A: Better insulation, heat resistance, and dimensional stability

Q: Minimum achievable thickness?
A: 0.3mm (0.5mm recommended)

Q: Custom shapes available?
A: Yes, with minimum 0.5mm hole diameter

Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications

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Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications

Ask Latest Price
Place of Origin :
Made In China
Brand Name :
Dayoo
MOQ :
Negotiable
Price :
Negotiable
Delivery Time :
Negotiable
Payment Terms :
Negotiable
Contact Supplier
Alumina Ceramic Substrates Unmatched Insulation And Thermal Conductivity For High-End Applications

Dayoo Advanced Ceramic Co.,Ltd

Verified Supplier
2 Years
zhejiang, jinhua
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter
Total Annual :
>1000000
Employee Number :
>100
Certification Level :
Verified Supplier
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