Electronic module protective cases are commonly made of PC, PBT, and ABS materials using high-precision injection molding, ensuring heat resistance, flame retardancy, and structural strength. They are used for external packaging of electronic functional modules.
| Parameter | Value Range/Description |
|---|---|
| Material | PC, ABS, PBT |
| Accuracy | ±0.03 mm |
| Wall Thickness | 0.8–2.5 mm |
| Mold Life | 600,000–1,000,000 Cycles |
| Molding Cycle | 12–25 seconds |
| Applications | Module housings, electronic devices |
| Features | Heat-resistant, flame-retardant, lightweight |
| Surface Treatment | Paint, Silkscreen |
| Protection Rating | IP20–IP54 |
| Dimensions | Customizable |
Used for packaging small electronic modules, circuit boards, and controllers
Provides protection and stability
We can customize the interface shape, snap-on design, exterior color, logo printing, and protection rating to create a differentiated module housing.