Revolutionizing Chip Fabrication Precision Innovation and Excellence

At the forefront of advanced chip foundry services, we empower innovation by transforming your design concepts into high-performance semiconductor and MEMS devices. With state-of-the-art facilities and a team of seasoned experts, we offer end-to-end solutions tailored to your unique requirements. Simply provide your design schematics and specifications, and we handle the rest—delivering precision-engineered wafers and components that meet the most demanding standards.

Our extensive portfolio of wafer materials includes Lithium Niobate (LiNbO₃), Lithium Tantalate (LiTaO₃), Single Crystal Quartz, Fused Silica Glass, Borosilicate Glass (BF33), Soda-Lime Glass, Silicon Wafers, and Sapphire, enabling us to support a wide range of applications across industries.

Cutting-Edge Processing Technologies

• Lithography:
  • Electron Beam Lithography (EBL): Ideal for ultra-high-resolution patterning, enabling nanoscale features for advanced photonic and quantum devices.
  • Proximity Lithography: Cost-effective solution for microfluidic chips and MEMS sensors.
  • Stepper Lithography: High-throughput, high-precision patterning for large-area wafers, perfect for integrated circuits (ICs) and optical components.
• Etching:
  • Ion Beam Etching (IBE): Delivers smooth, anisotropic etching for high-precision optical and acoustic wave devices.
  • Deep Reactive Ion Etching (DRIE): Enables high-aspect-ratio structures for MEMS accelerometers, gyroscopes, and inertial sensors.
  • Reactive Ion Etching (RIE): Versatile etching for thin-film transistors (TFTs) and microfluidic channels.
• Coating:
  • Electron Beam Evaporation: Deposits high-purity thin films for optoelectronic devices and superconducting circuits.
  • Magnetron Sputtering: Produces uniform coatings for RF filters, SAW devices, and protective layers.
  • LPCVD/PECVD/ALD: Advanced deposition techniques for dielectric layers, passivation, and nanostructured coatings.
• Bonding:
  • Anodic Bonding: Creates hermetic seals for MEMS pressure sensors and microfluidic devices.
  • Eutectic Bonding: Ensures robust, low-resistance interconnects for power electronics and LED packaging.
  • Adhesive/Wire Bonding: Provides flexible solutions for hybrid integration and IC packaging.
• Thinning, Cutting, and Drilling:
  • Precision Grinding and Thinning: Achieves ultra-thin wafers for flexible electronics and advanced packaging.
  • Dicing and Cutting: Enables clean, precise separation of dies for ICs and MEMS devices.
  • Laser Drilling: Creates micro-vias and through-silicon vias (TSVs) for 3D integration and interconnects.

Success Stories: Transforming Ideas into Reality

Our proven expertise has enabled groundbreaking innovations across multiple industries:

• Surface Acoustic Wave (SAW) Devices: Fabricated high-performance SAW filters and sensors for 5G communications and IoT applications.
• Lithium Niobate Ring Transducers: Delivered ultra-sensitive transducers for quantum computing and photonic circuits.
• Microfluidic Chips: Enabled lab-on-a-chip solutions for biomedical diagnostics and drug discovery.
• MEMS Accelerometers and Gyroscopes: Produced high-precision inertial sensors for automotive and aerospace systems.
• Optical Waveguides: Fabricated low-loss waveguides for integrated photonics and LiDAR systems.

Why Choose Us?

• End-to-End Solutions: From design consultation to final packaging, we provide seamless support for your projects.
• Material Versatility: Access to a wide range of wafer materials for diverse applications.
• Advanced Technologies: Leveraging the latest fabrication techniques to deliver superior performance.
• Proven Expertise: A track record of successful projects across industries, from telecommunications to healthcare.

Partner with us to unlock the full potential of your designs. Whether you're developing next-generation MEMS devices, photonic circuits, or microfluidic systems, we are your trusted partner in innovation. Let’s redefine the future of technology together.