Stainless Steel Pcb UV Laser Depaneling Machine System Optional 110V / 220V

Advantages of Laser PCB depaneling/singulation
- No mechanical stress on substrates or circuits
- No tooling cost or consumables.
- Versatility – ability to change applications by simply changing settings
- Fiducial Recognition – more precise and clean cut
- Optical Recognition before PCB depaneling/singulation process begins.
- Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc)
- Extraordinary cut quality holding tolerances as small as < 50 microns.
- No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards
Specification
| Parameter | |
| Technical parameters | Main body of laser | 1480mm*1360mm*1412 mm |
| Weight of the | 1500Kg |
| Power | AC220 V |
| Laser | 355 nm |
| Laser | Optowave 10W(US) |
| Material | ≤1.2 mm |
| Precision | ±20 μm |
| Platfor | ±2 μm |
| Platform | ±2 μm |
| Working area | 600*450 mm |
| Maximum | 3 KW |
| Vibrating | CTI(US) |
| Power | AC220 V |
| Diameter | 20±5 μm |
| Ambient | 20±2 ℃ |
| Ambient | <60 % |
| The Machine | Marble |
CE approval
Production flow