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‌FR4 Copper Base PCB Board 3.0m Thickness Thermoelectric Separation Board 2 Layer
‌FR4 Copper Base PCB Board 3.0m Thickness Thermoelectric Separation Board 2 Layer
Specifications
Layer :
2L
Thickness :
3.0mm
Surface Finish :
Immersion Gold
Min. Hole Size :
0.5mm
Min.Trace With/Spacing :
0.25/0.2mm
Raw Material :
Copper Base
Place of Origin :
China
Brand Name :
LJC
Certification :
UL ISO IATF1
MOQ :
10pcs
Price :
Negotiable
Packaging Details :
Carton
Delivery Time :
7-10 days
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Description

Specification

Layer 2L
Thickness 3.0mm
Copper Weight 3/3OZ
Surface Finish Immersion Gold
Min. Hole Size 0.5mm
Min.Trace With/Spacing 0.25/0.2mm
Application Power Supply
Note ‌FR4 and Copper Block Hybrid Lamination, Thermoelectric Separation Board

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‌FR4 Copper Base PCB Board 3.0m Thickness Thermoelectric Separation Board 2 Layer

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Product Detail
Layer :
2L
Thickness :
3.0mm
Surface Finish :
Immersion Gold
Min. Hole Size :
0.5mm
Min.Trace With/Spacing :
0.25/0.2mm
Raw Material :
Copper Base
Contact Supplier
‌FR4 Copper Base PCB Board 3.0m Thickness Thermoelectric Separation Board 2 Layer

Pingxiang Lianjin Cheng Technology Co., Ltd

Verified Supplier
1 Years
pingxiang
Since 2010
Business Type :
Manufacturer
Main Products :
Multilayer PCB, Copper Base PCB, Aluminum Base PCB
Total Annual :
140,000,000-168,000,000
Employee Number :
1200~2000
Certification Level :
Verified Supplier

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