Specifications
Material :
FR-4
Layout :
1-22 layer
Surface Finish :
OSP
VIPPO :
Via-In-Pad Plated Over
Place of Origin :
China
Brand Name :
LJC
Certification :
UL ISO IATF1
MOQ :
10pcs
Price :
Negotiable
Packaging Details :
Carton
Delivery Time :
7-10 days
Payment Terms :
L/C, D/A, D/P, T/T, Western Union, MoneyGram
Description
High-Density Interconnect (HDI) Technology
Characterized by microvias with a diameter ≤0.15mm, High-Density Interconnect (HDI) employs advanced fine-line patterning and microvia formation technologies to enable component interconnection within ultra-compact form factors. The architectural design—featuring minimized conductor geometries and optimized layer stacking—facilitates a wiring density an order of magnitude higher than conventional printed circuit boards (PCBs), critical for high-performance miniaturized systems.

Electrical performance is substantially enhanced through precise control of parasitic effects: reduction of residual stub inductance, elimination of discrete decoupling capacitors via integrated power/ground planes, and mitigation of crosstalk through controlled impedance routing. Furthermore, the strategic placement of adjacent ground planes—enabled by HDI’s thin dielectric layers—reduces radiated electromagnetic interference (RFI/EMI) by minimizing loop inductance and ensuring uniform distributed capacitance, thereby optimizing signal integrity across high-frequency transmission paths.
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Customizable High Density Interconnect HDI PCB FR-4 Material Circuit Boards With VIPPO

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Material :
FR-4
Layout :
1-22 layer
Surface Finish :
OSP
VIPPO :
Via-In-Pad Plated Over
Place of Origin :
China
Brand Name :
LJC
Contact Supplier
Customizable High Density Interconnect HDI PCB FR-4 Material Circuit Boards With VIPPO

Pingxiang Lianjin Cheng Technology Co., Ltd

Verified Supplier
1 Years
pingxiang
Since 2010
Business Type :
Manufacturer
Total Annual :
140,000,000-168,000,000
Employee Number :
1200~2000
Certification Level :
Verified Supplier
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