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Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM
Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM
Specifications
MOQ :
1
Price :
Send us Gerber file for free quotation
Payment Terms :
T/T
Layer :
14 Layer
Material :
Polyimide
Thickness :
1.5mm
Copper Thickness :
4OZ
Surface Treatment :
ENIG
Max. Line Width/Space :
2.54/1.27mm
Application :
Automotive Electronics
Certificate :
UL,IATF16949,ISO&Reach
Description

High-performance Substrate Polyimide Thick Copper PCB Multilayer Copper Stacked PCB Board

♦ What is Thick copper PCB?

Thick copper PCB refers to a circuit board formed by bonding a layer of copper foil with a thickness of 2 ounces (oz, about 62.5 microns) or more to FR-4 or other substrates during the printed circuit board (PCB) manufacturing process.

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♦ Features of Thick Copper PCB

    • ​​​​Large current carrying capacity: copper thickness ≥3oz, can pass 100A+ current, low temperature rise.

    • ​​Strong heat dissipation: high thermal conductivity, heat dissipation efficiency increased by 5 times+, temperature rise reduced by 10-15℃.

    • ​​High mechanical strength: bending resistance increased by 50%, high temperature vibration resistance, adaptable to harsh environments.

    • ​​Electrical stability: low impedance, low loss, low risk of delamination at high temperature.

    • ​​Flexible design: supports wide line width (≥100mil) and multi-layer thick copper stacking.

    • ​​Complex process: etching/drilling is difficult, yield rate is 85%-90%.

    • ​​High cost: material + processing premium is 30%-50%, and the unit price is high.

♦ Applications of Thick Copper PCB

    • ​​Power supply equipment: high-power switching power supply, inverter, UPS, etc.
    • ​​Automotive electronics: electric vehicle motor controller, on-board charger, battery management system.
    • ​​Industrial control: motor driver, servo controller, welding equipment.
    • ​​New energy field: photovoltaic inverter, wind power converter.
    • High-power LED lighting: LED driver board that needs heat dissipation and current carrying

♦ Technical Parameters

Item

Specification

Laers

1~32

Board thickness

0.1mm-7.0mm

Material

FR-4,CEM-1/CEM-3,PI,High Tg,Rogers

Max panel size

32"×48"(800mm×1200mm)

Min hole size

0.075mm

Min line width

3mil(0.075mm)

Surface finish

OSP,HASL,Imm Gold/Nickel/Ag, Electric gold

Copper thickness

0.5-7.0OZ

Soldermask

Green/Yellow/Black/White/Red/Blue

Silkscreen

Red/Yellow/Black/White

Min PAD

5mil(0.13mm)

Inter package

Vacuum

Outer package

Carton

Outline tolerance

±0.75mm

Hole tolerance

PTH:±0.05 NPTH:±0.025

Certificate

UL,ISO 9001,ISO14001,IATF16949

Special request

Blind hole+Gold finger + BGA

Material Suppilers

Shengyi, KB, Nanya, ITEQ,etc.

♦ One-Stop PCBs Solution

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♦ Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry；
    • Perfect after-sales service system；
    • From prototype to mass production

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Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM

Ask Latest Price
Product Detail
MOQ :
1
Price :
Send us Gerber file for free quotation
Payment Terms :
T/T
Layer :
14 Layer
Material :
Polyimide
Thickness :
1.5mm
Contact Supplier
Polyimide Thick Copper PCB Substrate Multilayer Board Fabrication Service ODM

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Main Products :
PCB Manufacturing, PCB Prototype, SMT Assembly
Employee Number :
>800
Certification Level :
Verified Supplier
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