Specifications
MOQ :
1
Price :
Inquiry Us
Payment Terms :
T/T
Layer :
2Layer
Board Thickness :
0.3m
Board Material :
Polyimide (PI)
Finished Copper :
0.5 OZ
Min Line Width/Spacing :
0.1/0.1mm
Surface Finish :
ENIG/OSP/Immersion Silver
Application :
3D Electronic Integration
Certificate :
UL,IATF16949,ISO&Reach
Description

3D Adaptation Lightweight Flexible PCB for 3D Electronic Integration Scenarios

What is Flexible PCB

​Flexible PCB (FPC)​​, also called a ​​"soft board"​​ or ​​flexible circuit​​, is a type of printed circuit board (PCB) made from ​​flexible insulating materials​​, such as ​​polyimide (PI)​​ or ​​polyester (PET)​​, instead of rigid fiberglass (FR4). This unique construction allows FPCs to ​​bend, fold, and twist​​ without breaking, enabling ​​compact, lightweight, and space-saving designs​​ in modern electronics.

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Features of FPC for 3D Electronic Integration

    • ​​Space efficiency​​: ultra-thin and foldable, making full use of small space.
    • ​​Flexible design​​: arbitrary bending, adapting to complex 3D structures.
    • ​​High reliability​​: reducing connection points and reducing the risk of failure.
    • ​​Excellent heat dissipation​​: thin + high thermal conductivity, quickly dissipating heat.

Difficulties in Flexible PCB Manufacturing

    • ​​Base material is fragile: PI film is thin and easy to wrinkle and crack, low-tension precision processing is required.

    • Micro-line is difficult to control: micron-level line width/spacing, electroplating and hole filling are prone to defects.

    • Strict alignment: multi-layer lamination requires high precision, and offset affects yield.

    • Surface sensitivity: The plating needs to balance flexibility and conductivity, and the process window is narrow.

    • Complex detection: internal line defects are difficult to detect, relying on expensive equipment such as X-ray.

Applications of Flexible PCB

    • ​​Smartphones & Wearables​​ (foldable screens, flexible displays);

    • ​​Laptops & Tablets​​ (hinge connections, battery flex cables);

    • ​Automotive Electronics​​ (sensors, lighting, dashboard controls);

    • ​​Medical Devices​​ (implantable electronics, diagnostic equipment);

    • ​​Aerospace & Defense​​ (lightweight, high-reliability circuits).

Technical Parameters

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

One-Stop PCBs Solution

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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

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OEM Lightweight Rigid Flex Rigid PCB Circuit Boards For 3D Electronic Integration Scenarios

Ask Latest Price
MOQ :
1
Price :
Inquiry Us
Payment Terms :
T/T
Layer :
2Layer
Board Thickness :
0.3m
Board Material :
Polyimide (PI)
Contact Supplier
OEM Lightweight Rigid Flex Rigid PCB Circuit Boards For 3D Electronic Integration Scenarios

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Employee Number :
>800
Certification Level :
Verified Supplier
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