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BMS Printed Circuit Board Assembly Electronic PCB Assembly
BMS Printed Circuit Board Assembly Electronic PCB Assembly
Specifications
MOQ :
1
Price :
Inquiry Us
Payment Terms :
T/T
Layer :
12L
Base Material :
FR4
Min. Component Size :
0201
PCB Thickness :
1.5mm
Pin Space :
0.1mm
Surface Finish :
HASL
Testing Method :
Flying Probe, ICT, Functional Test,AOI
Application :
Tablet
Description

BMS Printed Circuit Board Assembly Electronic PCB Assembly


♦ What is BMS?


A BMS is a Battery Management System—the electronic “brain” that keeps a rechargeable battery pack safe, reliable, and long-lasting.
It is almost always built around a dedicated BMS PCBA (assembled circuit board) that is mounted directly on or inside the battery pack.



♦ Key Jobs the BMS PCBA Continuously Performs:

  • Key jobs the BMS PCBA continuously performs:
  • Cell-level voltage monitoring (over-charge & over-discharge protection)
  • Current monitoring (charge/discharge over-current & short-circuit cut-off)
  • Temperature sensing (thermal run-away prevention; heater control in cold)
  • Cell balancing (bleeds charge from higher-voltage cells so the pack stays in balance, raising usable capacity and life)
  • State-of-charge (SOC) & state-of-health (SOH) fuel-gauge calculations
  • Communication (I²C, CAN, UART, BLE, etc.) to host device or charger
  • Power-path / pre-charge control (hot-swap inrush limiting, sleep-mode MOSFETs)


♦ DQS's PCB Assembly Capability


Item

Normal

Special

SMT

Assembly

PCB(used for SMT)

specification

Length and Width( L* W)

Minimum

L≥3mm, W≥3mm

L＜2mm

Maximum

L≤800mm, W≤460mm

L ＞ 1200mm, W＞500mm

Thickness( T)

Thinnest

0.2mm

T＜0.1mm

Thickest

4 mm

T＞4.5mm

SMT components specification

Outline Dimension

Min size

0201(0.6mm*0.3mm)

01005(0.3mm*0.2mm)

Max size

200 * 125

200 * 125

component thickness

T≤15mm

6.5mm＜T≤15mm

QFP,SOP,SOJ

(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch＜0.4mm

CSP/ BGA

Min ball space

0.5mm

0.3mm≤Pitch＜0.5mm

DIP

Assembly

PCB specification

Length and Width( L* W)

Minimum

L≥50mm, W≥30mm

L＜50mm

Maximum

L≤1200mm, W≤450mm

L≥1200mm, W≥500mm

Thickness( T)

Thinnest

0.8mm

T＜0.8mm

Thickest

3.5mm

T＞2mm




♦ One-Stop Electronic Manufacturing Including


PCB Prototype

Quick Turn PCB

Single-Sided PCB

Double-Sided PCB

Multilayer PCB

Rigid PCB

Flexible PCB

 Rigid-Flex PCB Rigid-Flex PCB Aluminum PCB Metal Core PCB

Thick Copper PCB

HDI PCB

 BGA PCB High TG PCB PCB Stencil Impedance Control PCB

PCB Assembly
High-Frequency PCB Bluetooth Circuit Board Automotive PCB USB Circuit Board Halogen-Free PCB

Antenna PCB



♦ Core Competencies of DQS PCB Assembly


SMT

BMS Printed Circuit Board Assembly Electronic PCB Assembly

 DIP

BMS Printed Circuit Board Assembly Electronic PCB Assembly
  • 13 automatic high-speed SMT line
  • 5 million points / day
  • FPC/Double sided mounted
  • Automatic conformal coating
  • 4 DIP line
  • Post-soldering700,000 points/day
  • Professional DIP plug-in team
BMS Printed Circuit Board Assembly Electronic PCB Assembly SMT Technology BMS Printed Circuit Board Assembly Electronic PCB Assembly PCBA OEM
  • Min package: 01005
  • Min pin: 0.3mm
  • Min BGA pitch: 0.3 mm


  • Full turnkey PCB assembly
  • Partial turnkey PCB assembly




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BMS Printed Circuit Board Assembly Electronic PCB Assembly

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Product Detail
MOQ :
1
Price :
Inquiry Us
Payment Terms :
T/T
Layer :
12L
Base Material :
FR4
Min. Component Size :
0201
Contact Supplier
video
BMS Printed Circuit Board Assembly Electronic PCB Assembly

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Main Products :
PCB Manufacturing, PCB Prototype, SMT Assembly
Employee Number :
>800
Certification Level :
Verified Supplier
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