2mm Thickness 2OZ ENIG Aluminum PCB for Power
♦ What is Aluminum PCB?
Aluminum substrate is a functional circuit board with aluminum (or aluminum alloy) as the base material. It is mainly composed of circuit layer (copper foil), insulation layer and metal base layer. Its core value lies in efficient heat dissipation and high power carrying capacity. It is widely used in electronic devices that are sensitive to heat or require high current drive.
♦ Features of Aluminum PCB
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- Excellent heat dissipation performance: The core advantage of aluminum-based PCBs is the high thermal conductivity of the substrate itself (the thermal conductivity of aluminum is usually 150~240 W/(m·K), much higher than the 0.3~0.5 W/(m·K) of ordinary FR-4 epoxy resin boards). Heat can be quickly transferred to the housing or heat sink through the aluminum substrate to avoid local overheating.
- Good electrical performance: The dielectric constant of the insulating layer is usually 3~5 (lower than 4~5 of FR-4, but higher than ceramic substrate), which is suitable for medium and high frequency circuits (but high frequency applications still require ceramic substrates).
- High rigidity: The mechanical strength of aluminum substrate is better than that of organic substrates such as FR-4, and it has strong resistance to bending and vibration, making it suitable for scenarios with high requirements for structural stability (such as automobiles and industrial equipment).
♦ Applications of Aluminum PCB
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- LED lighting: Solve the problem of high heating of LED lamp beads (such as street lights, spotlights, and car headlights) to ensure stable lighting effect and life.
- Power supply and power devices: Adapt to high-current devices such as switching power supplies, inverters, and frequency converters, and quickly dissipate the heat of components such as IGBTs and MOS tubes.
- Automotive electronics: Used in on-board chargers (OBCs), DC-DC converters, and car light drive modules to cope with high temperature environments in the engine compartment.
- Industrial control: Heat dissipation and circuit integration of high-voltage equipment such as servo drives and PLC controllers.
♦ Technical Parameters
| Item | Specification |
| Laers | 1~32 |
| Board thickness | 0.1mm-7.0mm |
| Material | FR-4,CEM-1/CEM-3,PI,High Tg,Rogers |
| Max panel size | 32"×48"(800mm×1200mm) |
| Min hole size | 0.075mm |
| Min line width | 3mil(0.075mm) |
| Surface finish | OSP,HASL,Imm Gold/Nickel/Ag, Electric gold |
| Copper thickness | 0.5-7.0OZ |
| Soldermask | Green/Yellow/Black/White/Red/Blue |
| Silkscreen | Red/Yellow/Black/White |
| Min PAD | 5mil(0.13mm) |
| Inter package | Vacuum |
| Outer package | Carton |
| Outline tolerance | ±0.75mm |
| Hole tolerance | PTH:±0.05 NPTH:±0.025 |
| Certificate | UL,ISO 9001,ISO14001,IATF16949 |
| Special request | Blind hole+Gold finger + BGA |
| Material Suppilers | Shengyi, KB, Nanya, ITEQ,etc. |