Specifications
Brand Name :
Kingtech
Place of Origin :
China
Certification :
GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000
MOQ :
1pcs
Price :
By quote
Packaging Details :
Vacuum packing
Delivery Time :
2-7days
Payment Terms :
By quote
Supply Ability :
500000 SQM per month
Min. Line widthe/space :
0.04mm/ 0.04mm
Warpage :
≤0.4%
BGA Pitch :
0.3mm
Misalignment of layers :
+/- 0.06
Blind Hole Aspect Ratio :
1:1
Vias Aspect Ratio :
16:1
Min. Mechanical Drill Hole size :
0.1mm
Impedance Control :
±8%
Description
Product Overview
This ODM HDI PCB is engineered for high-density, multilayer electronic applications requiring stable thermal performance, fine-pitch routing, and reliable signal integrity. Utilizing high-Tg laminate materials and controlled HDI processes, the board maintains mechanical and electrical stability under continuous thermal stress. Ideal for industrial control systems, communication equipment, and advanced embedded systems. We support complete production from prototype to volume manufacturing, ensuring design consistency throughout all stages.

Key Technical Capabilities


  • Product Name: HDI
  • Min. Line Widthe/Space: 0.04mm/ 0.04mm
  • Warpage: ≤0.4%
  • Impedance Control: ±8%
  • Min. Laser Drill Hole Size: 0.07mm
  • Copper Thickness: 1/3-8
  • High Density Interconnect (HDI) Printed Circuit Boards



Parameter Value
Warpage ≤0.4%
Impedance Control ±8%
Max. Board size 540*620
Misalignment of layers +/- 0.06
Board Thickness 0.2-3.2mm
Min. Core Thickness 0.05
Min. Mechanical Drill Hole size 0.1mm
Vias Aspect Ratio 16:1
BGA Pitch 0.3mm
Min. Line widthe/space 0.04mm/ 0.04mm

Why Choose Our OEM PCB Boards?
  • Direct PCB Manufacturer – no trading risk
  • Fast Turnaround for prototypes and NPI projects
  • Strict Quality Control (ISO / IATF / AS standards)
  • Engineering Support for DFM & stack-up
  • Stable Mass Production Capability
  • Export-oriented factory serving EU & US markets

Fast Turn HDI PCB Prototyping with 0.04mm Line Width/Space and 0.3mm BGA Pitch for Compact Designs

Fast Turn HDI PCB Prototyping with 0.04mm Line Width/Space and 0.3mm BGA Pitch for Compact Designs

pplication Areas


  • This fast turn HDI PCB solution is widely used in:
  • Compact consumer electronics
  • IoT & smart hardware
  • Embedded control modules
  • Communication and terminal devices


These applications typically require small form factor designs and fast iteration cycles.


Certifications & Compliance
  • UL certified PCB manufacturing
  • ISO 9001 quality management system
  • IATF 16949 compliant process (automotive projects)
Certificates and test reports can be provided upon request.
Fast Turn HDI PCB Prototyping with 0.04mm Line Width/Space and 0.3mm BGA Pitch for Compact Designs

FAQ – Prototype & NPI Focused


Q:What is the minimum order quantity for HDI PCB prototypes?
A:We support MOQ from 1 piece for HDI PCB prototype orders, suitable for NPI and design verification stages.
Q:Can you support impedance control for HDI multilayer PCBs?
A:Yes. We provide controlled impedance HDI PCB manufacturing, typically within ±10% tolerance, based on customer stack-up and test coupons. Impedance test reports can be provided upon request.
Q:Do you assist with HDI stack-up and design optimization?
A:Yes. For ODM and custom HDI projects, we can assist with stack-up planning, material selection (high Tg), BGA fanout feasibility, and DFM review to improve manufacturability and yield.
Q:What is the typical lead time for HDI PCB orders?
A:HDI prototypes: 3-7 working days
Low-volume production: depends on layer count and complexity
Mass production: scheduled based on confirmed specifications and quantity
Q:What high Tg materials do you use for HDI PCBs?
A:We work with high Tg FR-4 materials (Tg ≥170°C) from qualified suppliers. Specific material brands can be selected according to thermal and reliability specifications.
Q:Can you provide UL or quality certificates?
A:Yes. Our HDI PCB manufacturing process is UL certified, and we operate under ISO 9001 and IATF 16949 compliant processes. Certificates are available upon request.

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Fast Turn HDI PCB Prototyping with 0.04mm Line Width/Space and 0.3mm BGA Pitch for Compact Designs

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Brand Name :
Kingtech
Place of Origin :
China
Certification :
GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000
MOQ :
1pcs
Price :
By quote
Packaging Details :
Vacuum packing
Contact Supplier
video
Fast Turn HDI PCB Prototyping with 0.04mm Line Width/Space and 0.3mm BGA Pitch for Compact Designs
Fast Turn HDI PCB Prototyping with 0.04mm Line Width/Space and 0.3mm BGA Pitch for Compact Designs

HONGKONG KINGTECH PCB SOLUTION LIMITED

Verified Supplier
3 Years
shenzhen
Since 2001
Business Type :
Manufacturer
Total Annual :
$500M-$500M
Employee Number :
3000~4000
Certification Level :
Verified Supplier
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