Specifications
Brand Name :
Kingtech
Place of Origin :
China
Certification :
GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000
MOQ :
1pcs
Price :
By quote
Packaging Details :
Vacuum packing
Delivery Time :
2-7days
Payment Terms :
By quote
Supply Ability :
500000 SQM per month
Blind Hole Aspect Ratio :
1:1
Min. Line widthe/space :
0.04mm/ 0.04mm
Min. Laser Drill Hole size :
0.07mm
Max. Board size :
540*620
BGA Pitch :
0.3mm
Board Thickness :
0.2-3.2mm
Min. Mechanical Drill Hole size :
0.1mm
Copper thickness :
1/3-8
Description
We provide HDI PCB & PCBA manufacturing for industrial control applications, supporting automation systems, embedded control boards, and high-reliability industrial electronics.
Our HDI PCB solutions are designed for compact layouts, fine-pitch components, and stable performance in demanding industrial environments.


Key Technical Capabilities

  • Product Name: HDI PCB Board
  • Misalignment of layers: +/- 0.06
  • Blind Hole Aspect Ratio: 1:1
  • Impedance Control: ±8%
  • Board Thickness: 0.2-3.2mm
  • Min. Mechanical Drill Hole size: 0.1mm
  • HDI Consumer Electronics
  • HDI PCB Board
  • HDI Consumer Electronics
HDI PCB Board Technical Parameters
Product Name HDI PCB Board
Application HDI Consumer Electronics
Technology HDI PCB Board Technology
Blind Hole Aspect Ratio 1:1
Max. Board Size 540*620 mm
Min. Laser Drill Hole Size 0.07 mm
Impedance Control ±8%
BGA Pitch 0.3 mm
Misalignment of Layers +/- 0.06 mm
Warpage ≤0.4%
Copper Thickness 1/3-8 oz
Min. Line Width/Space 0.04 mm/ 0.04 mm
Vias Aspect Ratio 16:1
Why Choose Our OEM PCB Boards?
  • Direct PCB Manufacturer – no trading risk
  • Fast Turnaround for prototypes and NPI projects
  • Strict Quality Control (ISO / IATF / AS standards)
  • Engineering Support for DFM & stack-up
  • Stable Mass Production Capability
  • Export-oriented factory serving EU & US markets

High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control

High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control

Application Areas
This HDI PCB solution is commonly implemented in:
  • Industrial automation control systems
  • Communication & networking equipment
  • Embedded computing modules
  • Power management & signal processing boards
If your design involves high component density, fine-pitch BGAs, or thermal challenges, this solution provides optimal performance and reliability.
Certifications & Compliance
  • UL certified PCB manufacturing
  • ISO 9001 quality management system
  • IATF 16949 compliant process (automotive projects)
Certificates and test reports can be provided upon request.
High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control
FAQ - Prototype & NPI Focused
Q: What is the minimum order quantity for HDI PCB prototypes?
A: We support MOQ from 1 piece for HDI PCB prototype orders, suitable for NPI and design verification stages.
Q: Can you support impedance control for HDI multilayer PCBs?
A: Yes. We provide controlled impedance HDI PCB manufacturing, typically within ±10% tolerance, based on customer stack-up and test coupons. Impedance test reports can be provided upon request.
Q: Do you assist with HDI stack-up and design optimization?
A: Yes. For ODM and custom HDI projects, we can assist with stack-up planning, material selection (high Tg), BGA fanout feasibility, and DFM review to improve manufacturability and yield.
Q: What is the typical lead time for HDI PCB orders?
A: HDI prototypes: 3-7 working days
Low-volume production: depends on layer count and complexity
Mass production: scheduled based on confirmed specifications and quantity
Q: What high Tg materials do you use for HDI PCBs?
A: We work with high Tg FR-4 materials (Tg ≥170°C) from qualified suppliers. Specific material brands can be selected according to thermal and reliability specifications.
Q: Can you provide UL or quality certificates?
A: Yes. Our HDI PCB manufacturing process is UL certified, and we operate under ISO 9001 and IATF 16949 compliant processes. Certificates are available upon request.
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High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control

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Brand Name :
Kingtech
Place of Origin :
China
Certification :
GJB9001C, ISO13485, ISO9001, IS045001,IATF16949, UL, ISO14001, AS9100D, QC080000
MOQ :
1pcs
Price :
By quote
Packaging Details :
Vacuum packing
Contact Supplier
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High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control
High Density Interconnect PCB Board with 0.04mm Line Width 0.3mm BGA Pitch and 540x620mm Board Size for Industrial Control

HONGKONG KINGTECH PCB SOLUTION LIMITED

Verified Supplier
3 Years
shenzhen
Since 2001
Business Type :
Manufacturer
Total Annual :
$500M-$500M
Employee Number :
3000~4000
Certification Level :
Verified Supplier
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