BGA Rework Station:

BGA rework stations are specialized equipment used to remove and replace BGA components on printed circuit boards (PCBs).
BGA components are surface-mount integrated circuits (ICs) that have a grid of solder balls on the underside, which pose unique challenges during repair and rework.

Key Components:
Precision Heating System: Typically uses infrared (IR) or hot air to selectively heat the BGA component for safe removal and installation.
Component Removal and Placement Tools: Utilize vacuum nozzles or other specialized tools to gently lift and position the BGA component.
Alignment and Vision Systems: Ensure precise alignment of the BGA component during placement, often with the help of cameras and software.
Rework Platforms: Provide a secure and temperature-controlled environment for the rework process.

Rework Process:
Preparation: The PCB is secured on the rework platform, and the area around the target BGA component is prepared for rework.
Heating: The heating system is used to gradually heat the BGA component, melting the solder balls and allowing the component to be removed.
Removal: The component is carefully lifted off the PCB using specialized tools, without damaging the underlying pads or traces.
Cleaning: The PCB pads are cleaned to remove any residual solder or flux, ensuring a clean surface for the new component.
New Component Placement: The replacement BGA component is precisely aligned and placed on the PCB, then reflowed using the heating system.

Applications:
Electronics Repair and Rework: Replacing faulty or damaged BGA components on PCBs, such as those found in consumer electronics, industrial equipment, and aerospace/defense systems.
Prototype Modifications: Allowing engineers to quickly and accurately rework BGA components during the product development phase.
Production Support: Enabling the rework of BGA components during small-scale or batch production runs.