Our Selective Wave Soldering Machine is designed for high-precision PCB assembly, especially suitable for THT (Through-Hole Technology) components. Equipped with advanced nitrogen (N₂) protection and infrared preheating system, it ensures excellent soldering quality and production stability.
Specification
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Applicable PCB Board Size |
L*W: 50×50 ~ 600×500 mm |
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Applicable PCB Board Thickness |
Substrate Thickness: 0.8 ~ 3 mm / Lead Length: Within 3mm |
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Component Height |
Below 150mm above the substrate / Below 75mm below the substrate |
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Substrate Shape & Conditions |
1. Substrate Edge Margin: ≥3mm of substrate process edge2. Weight of components with substrate: ≤5KG3. Substrate Warpage: ≤0.5 mm |
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Solder Pot |
Solder Pot Material/Capacity: Full titanium alloy material / 12KGSolder Tank Capacity: Power: 4*500W 2KW |
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Bottom Full-board Preheating |
Infrared preheating 2.5 KW |
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Synchronous Preheating Power During Soldering |
Infrared preheating 800 W |
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Total Power |
AC 220V 5.5KW |
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N₂ Requirements |
Nitrogen Purity: 99.999%Pressure/Consumption: 0.5MPa / 20ℓ/min~30ℓ/min / 1.2-1.8 cubic H |
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Flux Nozzle |
0.5mm Japan imported original precision atomizing nozzle / 130um line spray (optional) |
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Flux Capacity |
2 L |
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Air Source |
0.5-0.7Mpa |
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Nozzle Inner Diameter |
φ 3mm ~ φ 20mm, customizable size |
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Wave Height |
Automatic calibration/height measurement |
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System Control |
PC+PLC (Windows + Huichuan) |
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Programming Software |
Support programming by picture drawing (convenient and fast) |
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Video Monitoring |
Real-time video monitoring for easy viewing of soldering effects |
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Power/Power Rating |
Single-phase 220V±10% Starting power: 5KW |
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Weight |
400KG (including 12KG solder) |
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Overall Dimensions |
LWH 1200×1530×1600 mm |



