The HS-600 SMT Stencil Cleaning Machine is a pneumatic, high-efficiency cleaning solution designed for removing solder paste, flux, and contaminants from SMT stencils. It combines high-pressure cleaning, rotary spray technology, and fast drying in one integrated system, helping improve solder paste printing quality and reduce SMT defects. This machine is widely used in PCB assembly, SMT production lines, EMS factories, and electronics manufacturing environments.

No electrical connection required (no 110V/220V), powered entirely by compressed air. Suitable for factories with strict safety and explosion-proof requirements.

• Integrated cleaning + drying process
• Cleaning time: 2-4 minutes
• Drying time: 2-5 minutes

Improves efficiency and reduces manual intervention.

• Rotary double-side spray cleaning
• High-pressure air + solvent injection
• Effectively removes solder paste, flux residues, and contaminants

Ensures consistent stencil performance in SMT printing.

This stencil cleaning machine supports:

• SMT stencil
• Copper screen
• Glue screen

Compatible with standard stencil sizes up to 29 inches

3-stage precision filtration:

• 10μm / 5μm / 1μm

Reduces cleaning liquid consumption and operating cost.

• Full stainless steel body
• Anti-corrosion, acid and alkali resistant
• Designed for long-term use in SMT environments

• Easy operation interface
• Automatic cleaning cycle
• Emergency stop for safety

This SMT stencil cleaner is widely used in:

• SMT production lines
• PCB assembly factories
• EMS / OEM manufacturing
• Automotive electronics production
• Consumer electronics manufacturing

Using an automatic stencil cleaning machine helps:

• Improve solder paste printing quality
• Reduce SMT defects (bridging, insufficient solder)
• Extend stencil lifespan
• Lower maintenance and labor costs