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High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen
High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen
High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen
High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen
Specifications
Brand Name :
HSTECH
Model Number :
HS-700
Certification :
CE
Place of Origin :
China
MOQ :
1 set
Price :
Negotiable
Payment Terms :
T/T, Western Union, MoneyGram
Supply Ability :
100 sets per month
Delivery Time :
7~9 work days
Packaging Details :
Wooden package
Product Name :
Mobile Phone BGA Rework Station
Warranty :
1 Year
Control :
Touch screen
PLC :
MITSUBISHI
Relay Brand :
Schneider
Optoelectronic Switch :
OMRON
Material :
Aluminum Alloy
Condition :
New
Thickness :
0.3 - 5mm
Signal :
SMEMA
Application :
Electronic Assembly
Color :
Silver
Control System :
PLC
OEM/ODM :
Available
Total power :
2600W
Power Supply :
AC220V
Air Pressure :
4-6bar
Mounting accuracy :
±0.01mm
Type :
Automatic
Weight :
30KG
Description

5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station

​Specification

Mobile Phone BGA Rework Station Model:HS-700
Power Supply AC 100V / 220V±10% 50/60Hz
Total power 2600W
Heater power Top heater 1200W(Max), bottom heater 1200W(Max)
Electric material Driving motor + smart temp. controller + color touch screen
Temperature control high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃)
Sensor 1pcs
Locating way V shape PCB support + external universal fixture + laser light for centering and positioning
Overall dimension L450mm*W470mm*H670mm
PCB size Max 140mm*160mm Min 5mm*5mm
BGA size Max 50mm*50mm Min 1mm*1mm
Applicable PCB thickness 0.3 - 5mm
Mounting accuracy ±0.01mm
Weight of machine 30KG
Mount chip weight 150g
Working modes Five: Semi-auto/Manual/Remove/Mount/Weld
Usage Repair chips / phone motherboard etc

Repair steps


1.Separate the BGA chip from mother board –we called desoldering.
2.Clean Pad.
3.Reballing or replace a new BGA chip directly.
4.Alignment/Positioning – Depend on experience ,silk frame ,optical camera.
5. replace a new BGA chip - we called Soldering hot air smd rework station iphone ic replace machine.

About Packaging

High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen

High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen

High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen

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High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen

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Product Detail
Brand Name :
HSTECH
Model Number :
HS-700
Certification :
CE
Place of Origin :
China
MOQ :
1 set
Price :
Negotiable
Contact Supplier
High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen
High Precision K-sensor Mobile Phone BGA Reballing Station with 7' HD Color Touch Screen

Shenzhen Hansome Technology Co., Ltd.

Verified Supplier
7 Years
guangdong, shenzhen
Since 2012
Business Type :
Manufacturer
Main Products :
PCB Handling Equipment, PCB Depaneling Router Machine, Automatic Soldering Robot
Total Annual :
2,000,000.00-3,000,000.00
Employee Number :
80~100
Certification Level :
Verified Supplier
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