Specifications
Brand Name :
PCBgate
Model Number :
261503012
Certification :
ISO9001/UL/ISO14001/IATF16949/RoHS
Place of Origin :
China
MOQ :
1unit
Price :
1-2$
Payment Terms :
L/C,D/A,D/P,T/T,Western Union
Supply Ability :
1000unit,two days
Delivery Time :
7 work days
Packaging Details :
Vacum Packing
Base Material :
Ceramic
Layer Count :
1-38 Layers
Board Thickness :
0.2mm-6mm
Copper Thickness :
0.5oz-12oz(18μm - 420μm)
Surface Finish :
HASL/ENIG(Gold)/OSP/Immersion Gold
Solder Mask :
Green/White/Red/Blue/Black
Silkscreen :
White/Black/Yellow
Min. Trace Width/Space :
3mil/3 mil(0.075mm)
Min. Hole Size :
0.1mm(CNC Drilling) / 0.6mm (Punching)
Impedance Control :
Available
Testing :
100% Electrical Test
Max. Working :
1500 -1700 °C
Description

Product Overview:

As a printed circuit board (PCB) vendor in Asia, we are dedicated to be your best partner of specific, advanced, high-precision printed circuit boards, includes but not limited to FR4 PCB, aluminum PCB, but also ceramic PCB, high impedance control PCB.

Key Selling Points:

Ceramic Substrates are used in many electronic applications where a thin insulating layer of thermally stable material is required to conduct heat away from electronic components whilst electrically insulating them, and material is 92%, 96%, 99%alumina, zirconia and ZTA.

Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly

Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly

Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly

Engineering Support: DFM (Design for Manufacturing) check before production.

Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly

Testing: Flying Probe Test, Fixture Test, Impedance Control Test, Thermal Stress Test.

Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly

Why Ceramic PCB has such excellent performance?

96% or 98% Alumina (Al2O3), Aluminum Nitride (AIN), or Beryllium Oxide (BeO)
Conductors Material: For thin, thick film technology, it'll be silver palladium (AgPd), gold palladium (AuPd); For DCB (Direct Copper Bonded) it'll be copper only
Application temp: -55~850C
Thermal conductivity value: 24W~28W/m-K (Al2O3); 150W~240W/m-K for AIN , 220~250W/m-K for BeO;
Max compression strength: >7,000 N/cm2
Breakdown Voltage (KV/mm): 15/20/28 for 0.25mm/0.63mm/1.0mm respectively
Thermal expansion coefficient(ppm/K): 7.4 (under 50~200C)

Application of Ceramic PCB

high-accuracy clock oscillator, voltage controlled oscillator (VCXO), temperature compensated crystal oscillators (TCXOs), oven-controlled crystal oscillators (OCXOs);
Semiconductor cooler;
electric power electronic control module;
high insulation & high-pressure device;
high temperature (up to 800C)
high power LED
High Power semiconductor modules
solid state relay (SSR)
DC-DC module power sources
electric power transmitter modules
Solar-panel arrays

Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly

Ceramic PCB uses ceramic materials such as alumina.
It provides better heat performance than FR4.

It is widely used in:

•LED modules

•Power electronics

•Automotive systems

We provide stable and high-quality ceramic PCB solutions.

Our PCB manufacturing capability includes:

· Ceramic PCB fabrication

· DBC / DPC process support

· High thermal conductivity materials

· Thick copper ceramic PCB

· Prototype and mass production

Details for Ceramic PCB:

Technical

1). Professional surface mounting and through hole soldering technology;

2). Various sizes, like 1206, 0805, 0603, 0402, 0102 components SMT technology;

3). X-Ray, ICT(In Circuit Test), FCT(Functional Circuit Test) technology;

4). Nitrogen gas reflow soldering technology for SMT;

5). High standard SMT&Solder Assembly line;

6). High density interconnected board placement technology capacity.

Production Process:

PCB Manufacturing Process:

Engineering Review → Material Preparation → Circuit Pattern → Copper Bonding → Etching → Solder Mask → Surface Finish → Testing → Packing

PCBgate is a professional PCB manufacturer providing high-quality printed circuit boards for global electronics industries.

We are capable of manufacturing a wide range of PCB types to meet different application requirements, including:FR-4 PCBs,ceramic PCBs,carbon oil PCBs,Aluminum PCBs,Flexible & Rigid-Flex PCBs.


Key Specifications

Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly

Attention: pictures are for reference only. The specific products are subject to the original factory model.

Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly


Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board AssemblySilicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly

Standard Packaging: Inner Vacuum Packaging + Outer Carbon Box.

Delivery Partners: EMS,DHL,SF-express, FedEx, UPS or Sea/Air Freight for bulk orders.

Why Choose Us

15years experience in PCB manufacturing.

•Advanced Equipment: Equipped with high-speed CNC drilling machines and AOI testing lines.

•Professional engineering support

• Fast prototype delivery

• Global customers from Europe, USA and Asia

•Own Global Supply System.

•Fast and safe way by EMS/DHL/SF-express/Fedex,etc.

•New styles updating everyday and MOQ for all the styles;

FAQs

1. What's your MOQ?

A: Our MOQ is Minimum packaging quantity, please contact us for details.

2. What are your payment terms?

A:Advance T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Others

3.What files are required for PCB quotation?

A:Gerber files, PCB specifications and quantity.

Welcome to send us your PCB Gerber files for quotation.

Our engineering team will respond within 24 hours.

Send your message to this supplier
Send Now

Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly

Ask Latest Price
Brand Name :
PCBgate
Model Number :
261503012
Certification :
ISO9001/UL/ISO14001/IATF16949/RoHS
Place of Origin :
China
MOQ :
1unit
Price :
1-2$
Contact Supplier
Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly
Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly
Silicon Nitride Gold Ink IGBT Modules Pottery Printed Circuit Board Assembly

SHENZHEN PCBGATE GROUP Co.,Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2011
Business Type :
Manufacturer
Total Annual :
10000000-20000000
Employee Number :
100~200
Certification Level :
Verified Supplier
Contact Supplier
Submit Requirement