High Quality Dual-Channel Loading and Unloading Laser Solder Ball Jet Welding System for Production Line
System Overview
This advanced laser solder ball jet welding system features dual working platforms to maximize equipment utilization efficiency and production throughput.
Key Features & Benefits
- Dual working platforms significantly improve equipment utilization efficiency
- High-precision solder ball jet welding with application range of 350μm-760μm (standard: 500μm-760μm)
- Non-contact laser welding eliminates electrostatic damage concerns
- Natural cooling solder ball solidification prevents surface burrs on solder joints
- Compact BOND HEAD core welding mechanism for easy automated integration
- Flux-free operation ensures no pollution and maximizes electronic device lifespan
- Flexible welding capabilities by selecting appropriate solder ball sizes
- Advanced image recognition and positioning system for micro-precision device welding
- High efficiency and rapid processing speeds
The equipment operates via dual-channel loading and unloading for continuous production workflow.
Technical Specifications
| Machine Model |
YSL - LS200 |
| Laser Wavelength |
1064nm |
| Laser Power |
200W |
| X&Y Axis Speed |
500mm/s maximum |
| Z Axis Speed |
300mm/s maximum |
| Axis Type |
Servo Motor |
| Repeat Positioning Accuracy |
±5μm |
| Visual Recognition Rate |
99.5% |
| Solder Ball Size Range |
350μm~760μm (standard 500μm~760μm) |
| UPH (Units Per Hour) |
>7000-9000 (PIN) |
| Operating Temperature |
25℃ |
| Operating Humidity |
30%~65% (No condensation) |
| Dimensions |
Approx. 1300×1340×1530 (mm) |
| Weight (Approximate) |
350kg |
| Voltage |
220VAC, Single-phase |
| Maximum Current/Frequency |
15A, 50/60Hz |
| Nitrogen Pressure |
0.5MPa |