Pulse-Heated Soldering Machine for FPC to PCB Board
High-precision pulse heat welding equipment for board assembly with advanced thermode technology for reliable FPC to PCB bonding.
Model Specifications: YSPP-1A
- Accurate tin press without dragging
- Precise temperature control
- Fine-pitch positioning capability
- Digital program pressure control
Advanced Features
- Rotary table design enables extremely short cycle times with simultaneous loading/unloading during heat sealing
- High quality heat seal application up to 0.25mm pitch
- Pneumatic bonding head provides up to 3,900N force
- Digital programmable pressure control with LCD display
- Closed loop PID temperature control with visible LED display
- Real-time pressure sensor triggered bonding cycle
- Floating Thermode ensures consistent pressure and heat transfer along flexfoil to LCD and/or PCB
- Precision product fixtures (2X) with easy exchange, micrometer alignment, and vacuum component fixation
- Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
- Full microprocessor logic control for reliable operation
Technical Parameters
| Parameter |
Specification |
| Model |
YSPP-1A |
| Size |
500mm × 750mm × 910mm |
| Work Air Pressure |
0.5-0.7 MPA |
| Working Area |
110mm × 150mm |
| Temperature Setup |
0-400℃ |
| Tolerance of Temperature |
+2℃ |
| Time of Pressing |
0-99s |
| Tolerance of Pressing |
0.05 MPA |
Technology Overview
Hot bar soldering is extremely effective for bonding dissimilar components and parts that are difficult to unite. This pulse bonding technology differs from traditional soldering by using thermode technology based on rapid reflow through pulse heating. The procedure allows materials with low temperature resistance to be soldered at high lead-free temperatures without damaging the flex circuit. The system selectively solders parts by heating them to temperatures that melt adhesives or solder, which then re-solidify to form permanent, reliable bonds.