Specifications
Place of Origin :
Guangdong, China
Brand Name :
YUSH
MOQ :
1 set
Price :
$4,000 / set
Weight :
110 kg
Power :
10 kW
Voltage :
220V/110V
Model :
YSPP-1A
Size :
500mm X 750mm X 910mm
Work Air Pressure :
0.5-0.7MPA
Working Area :
110mm X 150mm
Temperature Range :
0-400℃
Temperature Tolerance :
+2℃
Pressing Time :
0-99s
Pressing Tolerance :
0.05MPA
Bonding Force :
3,900N
Heat Seal Pitch :
0.25mm
Core Components :
PLC, Gearbox, Motor, Pump
Cycle Time :
Extremely short
Description
FPC to PCB Board Pulse-Heated Soldering/Welding Machine
High-precision thermal bonding equipment designed for precision soldering applications requiring controlled thermal management.
Technology Overview
Hot bar soldering is highly effective for bonding dissimilar components that are difficult to unite using traditional methods. This pulse bonding technology utilizes thermode-based rapid reflow through pulse heating, enabling materials with low temperature resistance to be soldered at high lead-free temperatures without damaging flexible circuits. The process selectively heats components to melt adhesive or solder, which then re-solidifies to form permanent, reliable bonds.
FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment
Key Features
  • Extremely short cycle time with rotary table design allowing product loading/unloading during heat sealing process
  • High quality heat seal application for pitches up to 0.25mm
  • Pneumatic bonding head delivering up to 3,900N force
  • Digital programmable pressure control with LCD display
  • Closed loop PID temperature control with visible LED display
  • Bonding cycle triggered by real-time pressure sensor
  • Floating thermode ensuring consistent pressure and heat transfer along flexfoil to LCD and/or PCB
  • Precision product fixtures (2X) with micrometer alignment and vacuum component fixation
  • Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
  • Full microprocessor logic control system
FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment
Technical Specifications
Model YSPP-1A
Size 500mm × 750mm × 910mm
Work Air Pressure 0.5-0.7 MPA
Working Area 110mm × 150mm
Temperature Setup 0-400℃
Tolerance of Temperature +2℃
Time of Pressing 0-99s
Tolerance of Pressing 0.05 MPA
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FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment

Ask Latest Price
Place of Origin :
Guangdong, China
Brand Name :
YUSH
MOQ :
1 set
Price :
$4,000 / set
Weight :
110 kg
Power :
10 kW
Contact Supplier
FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment
FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment
FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment
FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment
FPC to PCB Board Pulse-Heated Soldering/Welding Machine /High-Precision Thermal Bonding Equipment

YUSH Electronic Technology Co.,Ltd

Verified Supplier
12 Years
jiangsu, suzhou
Since 2005
Business Type :
Manufacturer
Total Annual :
10000-50000
Employee Number :
1000~2000
Certification Level :
Verified Supplier
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