FPC to PCB Board Pulse-Heated Soldering/Welding Machine
High-precision thermal bonding equipment designed for precision soldering applications requiring controlled thermal management.
Technology Overview
Hot bar soldering is highly effective for bonding dissimilar components that are difficult to unite using traditional methods. This pulse bonding technology utilizes thermode-based rapid reflow through pulse heating, enabling materials with low temperature resistance to be soldered at high lead-free temperatures without damaging flexible circuits. The process selectively heats components to melt adhesive or solder, which then re-solidifies to form permanent, reliable bonds.
Key Features
- Extremely short cycle time with rotary table design allowing product loading/unloading during heat sealing process
- High quality heat seal application for pitches up to 0.25mm
- Pneumatic bonding head delivering up to 3,900N force
- Digital programmable pressure control with LCD display
- Closed loop PID temperature control with visible LED display
- Bonding cycle triggered by real-time pressure sensor
- Floating thermode ensuring consistent pressure and heat transfer along flexfoil to LCD and/or PCB
- Precision product fixtures (2X) with micrometer alignment and vacuum component fixation
- Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch applications
- Full microprocessor logic control system
Technical Specifications
| Model |
YSPP-1A |
| Size |
500mm × 750mm × 910mm |
| Work Air Pressure |
0.5-0.7 MPA |
| Working Area |
110mm × 150mm |
| Temperature Setup |
0-400℃ |
| Tolerance of Temperature |
+2℃ |
| Time of Pressing |
0-99s |
| Tolerance of Pressing |
0.05 MPA |