Specifications
Place of Origin :
Guangdong, China
Brand Name :
YUSH
MOQ :
1 set
Price :
$7,000 / set
Weight :
110 kg
Power :
10 kW
Voltage :
220V/380V
Model :
YSPC-1A
Working area :
200*260mm
Bonding force :
3,900N
Pitch capability :
0.25mm
Core components :
PLC, Gearbox, Motor, Pump
Temperature control :
Closed loop PID
Pressure control :
Digital programmable
Cycle time :
Extremely short
Thermode type :
Floating
Alignment system :
Micrometer/vacuum
Optional CCD :
Frame, camera, lens
Controller type :
Microprocessor based
Description
High Speed Hot Bar Soldering Machine for PCB and FPC Board Bonding
Advanced hot bar soldering system designed for precision bonding of printed circuit boards and flexible printed circuits with exceptional speed and accuracy.
High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board
Technical Details
  • Microprocessor-based controller provides precise and consistent temperature control
  • Unique pulsed heat thermos offers uniform temperature distribution with fast heating and cool-down
  • Flexible programmable profiles for targeted idle, preheat and reflow heating
  • Floating thermos and digital pressure switch ensure optimal pressure distribution across joints
  • CCD camera system with magnification lens available for fine-pitch positioning
High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board
Key Features
  • Extremely short cycle time with rotary table design
  • Product loading and unloading during heat sealing process
  • High quality heat seal application up to 0.25mm pitch
  • Pneumatic bonding head provides up to 3,900N force
  • Digital programmable pressure control with LCD display
  • Closed loop PID temperature control with visible LED display
  • Bonding cycle triggered by real-time pressure sensor
  • Floating Thermode ensures consistent pressure and heat transfer
  • Precision product fixtures with micrometer alignment and vacuum component fixation
  • Optional CCD alignment module for fine pitch applications
  • Full microprocessor logic control
High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board
Customer Support Advantages
  • Engineer overseas training for customers
  • Prompt technical support services
  • Rapid complaint handling with 30-minute response time
  • Reliable manufacturing with 15+ experts each having over six years of experience
Technical Specifications
Establishment Year 1999
Lead Time 5 days
Working Area 200 × 260mm
Fixture 1 set
High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board
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High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board

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Place of Origin :
Guangdong, China
Brand Name :
YUSH
MOQ :
1 set
Price :
$7,000 / set
Weight :
110 kg
Power :
10 kW
Contact Supplier
High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board
High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board
High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board
High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board
High Speed Hot Bar Soldering Machine Bonding PCB and Fpc Board

YUSH Electronic Technology Co.,Ltd

Verified Supplier
12 Years
jiangsu, suzhou
Since 2005
Business Type :
Manufacturer
Total Annual :
10000-50000
Employee Number :
1000~2000
Certification Level :
Verified Supplier
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