ZM-R7220A BGA Rework Station with Optical Alignment
Product Applications
This high-precision BGA rework station is designed for professional PCB repair and component replacement applications:
- De-solder and solder all types of BGA components (lead-free and leaded)
- Remove and repair motherboard BGA IC chips and other components
- Reduce production costs by reworking defective solder joints during PCB assembly
- Rework micro BGA, VGA, CCGA, QFN, CSP, LGA, SMD, and other chipset types
- Ideal for high-precision motherboard rework in laptops, gaming consoles, mobile phones, and electronic devices
Key Features
Advanced Heating System
- Large area infrared carbon fiber pre-heating system for fast, even heating without light pollution
- Independent control of top, bottom, and IR heaters with ±3℃ temperature accuracy
- Ten-segment temperature control process suitable for all BGA rework applications
- Adjustable IR preheating area for uniform PCB heating
Precision Optical Alignment
- Adjustable CCD color optical system with beam split, zoom, and micro-adjust functions
- Automatic chromatism resolution and brightness adjustment
- 230X magnification with mounting accuracy within ±0.02mm
- Prevents eye strain during extended rework sessions
Smart Operation System
- High-definition human-machine interface with authority-protected temperature parameters
- Automatic soldering and de-soldering functions with no manual adjustment required
- Unlimited temperature profile storage with one-key recall capability
- USB connection with driver-free PC control
- 360° rotating BGA nozzle system with easy installation and replacement
Safety & Protection
- CE certified with comprehensive safety protection functions
- Automatic power-off circuit when temperature exceeds control limits
- Password-protected temperature parameters to prevent unauthorized changes
- Completion alarms and double protection systems
- Protects PCB components and machine from damage during abnormal conditions
Technical Specifications
| Power Supply |
AC 220V ±10%, 50/60 Hz |
| Total Power |
Max 5650W |
| Heater Power |
Top: 1450W, Bottom: 1200W, IR: 2700W |
| Temperature Control |
K-type thermocouple (Closed Loop), ±3℃ accuracy |
| PCB Size Range |
Max: 415 × 370 mm, Min: 6 × 6 mm |
| BGA Chip Size |
Max: 60 × 60 mm, Min: 2 × 2 mm |
| Positioning System |
V-groove PCB support with universal fixture |
| Dimensions |
685 × 633 × 850 mm (L × W × H) |
| Weight |
76 kg |
| Color |
White |