YS-305 SMT Solder Paste - Environmental Friendly High Temperature Solder Paste
Product Overview
YS-305 SMT Solder Paste is an environmentally friendly, high-temperature solder paste designed for extended use without drying. This advanced formulation ensures reliable performance in surface mount technology applications with superior stability and excellent soldering characteristics.
Storage Guidelines
Storage Temperature and Duration: Store solder paste in a sealed environment at 5-10°C. The standard shelf life is 6 months. Always follow first-in-first-out (FIFO) principles.
Opened Solder Paste Storage: Recycle solder paste from screen boards into clean, contamination-free containers. Seal and store separately in refrigeration. Do not mix with new solder paste. Opened solder paste has a 5-day storage period. Discard any material exceeding this timeframe to maintain product quality.
Reusing Previous Batches: If unused solder paste appears dry, add a small amount of solder paste-specific thinner and mix thoroughly before use.
Key Features
- Produces bright, full solder joints with moderate viscosity and minimal solder beads
- Low residue after welding with high insulation resistance - will not corrode PCBs and meets no-clean requirements
- Extended continuous printing time with minimal slump hours after printing and stable viscosity for reduced component shifting
- Excellent wettability and superior welding performance with reliable ICT test results
Technical Specifications
| Parameter |
Specification |
| Graininess |
22-38 (μm) |
| Viscosity |
200 (Pa·S) |
| Activity |
High Activity |
| Fusing Point |
218°C |
| Alloy Component |
Tin Silver Copper Alloy |
| Cleaning Angle |
90° |
| Operating Temperature |
225-260°C |