YS-0307 SMT Solder Paste Environmental Friendly High Temperature Solder Paste for a Long Time Without Drying Solder Paste
Storage Guidelines
Proper storage ensures optimal performance and longevity of the solder paste:
- Storage Temperature & Duration: Store in sealed environment at 5-10°C with 6-month shelf life. Follow first-in-first-out principle.
- Opened Container Storage: Return unused paste to clean, contamination-free bottle and store separately in refrigeration. Do not mix with new solder paste. Use within 5 days after opening.
- Reviving Dried Paste: If paste appears dry, add small amount of solder paste thinner and mix thoroughly before use.
Key Features
- Bright, full solder joints with moderate viscosity and no bead formation
- Minimal residue after welding with high insulation resistance - non-corrosive to PCB and suitable for no-clean applications
- Extended continuous printing time with minimal slump hours after printing and stable viscosity for reduced component shifting
- Excellent wettability and superior welding performance with reliable ICT test results
Technical Specifications
| Graininess |
22-38 (um) |
| Viscosity |
200 (Pa*S) |
| Activity |
High activity |
| Fusing Point |
218°C |
| Alloy Component |
Tin silver copper alloy |
| Cleaning Angle |
90° |
| Operating Temperature |
225-260°C |