SMT Stencil Fiber Laser Cutting Machine for Solder Paste Printer
The YS-GW50 SMT Stencil Fiber Laser Cutting Machine from YUSHElectronic Technology Co., Ltd. is a high-performance solution for solder paste printer applications. This advanced cutting system combines precision engineering with innovative waste management for optimal performance in electronic manufacturing environments.
Key Features and Benefits
Advanced Waste Collection System: Innovative structure design with comprehensive waste and smoke collection that eliminates equipment stability issues caused by chips, slag, and iron dust, significantly extending equipment service life.
High Power Fiber Laser Technology: Semiconductor-pumped solid-state high-power fiber laser increases cutting efficiency and expands the range of machinable products, handling both ordinary metal sheets and precision parts with various thickness requirements.
Specialized Process Solutions: Professional fixture design accommodates materials of various sizes and shapes, optimizing user processes and maximizing equipment value through a complete equipment process system.
Technical Specifications
| Positioning Accuracy |
±3μm |
| Platform Repeatability |
±1.5μm |
| Platform Velocity |
≤300mm/S |
| Location Detection Sub Variability |
0.1μm |
| Cutting Range |
X 600mm × Y 600mm |
| Table Size |
X 620mm × Y 620mm |
| Cutting Thickness |
≤0.5mm (reference value) |
| Focus Diameter |
25-30μm |
| Best Cutting Effectiveness |
Up to 9400 Synthetic Aperture/hr, 13000-14000 standard aperture/hour (with 0.3mm diameter standard round date, 0.15mm less steel) |
Physical Dimensions: 1680 × 1500 × 1630mm | Weight: 1200KG