YS-8500 Universal X-Ray Inspection System
The YS-8500 utilizes COMET's open X-ray tube design, delivering exceptional defect inspection capability reaching 0.5μm. This advanced system supports multiple inspection methods including 2D, 3D, and CT imaging, making it ideal for quality inspection, 3D measurement, and non-destructive analysis applications.
Application Fields
Electronics & Semiconductor: Soldering quality inspection of PCB solder joints, BGA components, integrated circuits (IC) and bond wire inspection, semiconductor package inspection and internal connection analysis, electronic power (IGBT) module inspection, wafer defect inspection (WLCSP)
Industrial Components: Inspection of sensors, relays, fuses, coils, micro drive systems, air bag control systems, micro motors (MEMS, MOEMS), cables and plugs, plastic components
Materials & Castings: Comprehensive analysis of various materials including plastics, ceramics, biological materials, optical components, and small titanium and aluminum castings