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SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
Specifications
Place of Origin :
Guangdong, China
Brand Name :
YUSH
MOQ :
1 set
Price :
$19,000-22,000 / set
Weight :
850 kg
Power :
10 kW
Voltage :
220V/110V
Y-axis stroke :
310mm
Dimensions :
1040*1080*1750mm
Air consumption :
200L/min
Machine power :
4 KW
Air pressure :
0.5-0.6MPa
Max material diameter :
300 mm
Spindle power :
2.4 kw
Spindle speed :
60,000 rpm
Positioning accuracy :
0.001mm
Cutting speed :
0.05-400 mm/sec
Standard blade :
2 Inch
Max blade :
3 Inch
Description
SMT High Speed Semi Automatic Dicing Machine for Production Line
The dicing system utilizes a slim cutting blade mounted on a high-speed spindle to precisely cut materials including glass, ceramic, semiconductor chips, PCB, EMC wire frames, and other substrates with exceptional accuracy.
SMT High Speed Semi Automatic Dicing Machine for Production Line SMT High Speed Semi Automatic Dicing Machine for Production Line
Operation Procedures
Wafer or Strip
Tape mounting
Dicing
Cleaning
UV separation
SMT High Speed Semi Automatic Dicing Machine for Production Line SMT High Speed Semi Automatic Dicing Machine for Production Line
Semi-Automatic Dicing System Description
The semi-automatic dicing system features manual loading and unloading operations while automating the core dicing procedure. This system does not include automatic cleaning or drying functions.
Main Procedures
Feeding by hand
Position align
Auto-cutting
Unloading by hand
SMT High Speed Semi Automatic Dicing Machine for Production Line SMT High Speed Semi Automatic Dicing Machine for Production Line
  • Operator manually places cutting material on work platform
  • Automatic calibration of cutting position
  • Press start button to automatically complete dicing process
  • Operator manually removes finished material from work platform
Applications
Automatic dicing systems are widely used for precision cutting of semiconductor chips, LED chips, EMC lead frames, PCB boards, IR filters, sapphire glass, and ceramic thin plates.
Ceramic substrate
Silicon rubber
Lead frame
SMT High Speed Semi Automatic Dicing Machine for Production Line SMT High Speed Semi Automatic Dicing Machine for Production Line
Silicon wafer
PCB
Glass
SMT High Speed Semi Automatic Dicing Machine for Production Line SMT High Speed Semi Automatic Dicing Machine for Production Line
Operating Requirements
  • Use clean compressed air with atmospheric pressure dew point of -10°C to -20°C, residual oil content of 0.1ppm, and filtration accuracy above 0.01μm/99.5%
  • Operate in environment temperature of 20°C to 25°C with fluctuation range controlled at ±1°C
  • Maintain cutting water temperature at 22°C to 27°C (±1°C variation) and cooling water at 20°C to 25°C (±1°C variation)
  • Avoid external impacts and vibrations; do not install near high-temperature devices like blowers or vents, or equipment generating oil mist
  • Strictly follow provided product manual for operation
SMT High Speed Semi Automatic Dicing Machine for Production Line SMT High Speed Semi Automatic Dicing Machine for Production Line
YSL-1000SD Semi-Dicing System Features
Control Interface Touch LCD with simple interface design, multiple language support (Chinese, English, Korean)
Maximum Material Size 300mm diameter high precision cutting capability
Structural Design High rigidity design ensuring precision and stability during cutting process
Alignment System CCD automatic alignment
Monitoring System Real-time monitoring of air pressure, water pressure, current values to prevent spindle damage
Cutting Spindle 2.4 kW × 1 set (Maximum: 60,000 rpm)
Positioning Accuracy 0.001mm repeat positioning accuracy
Cutting Speed 0.05 ~ 400 mm/sec
Standard Blade 2 Inch (Maximum: 3 Inch)
SMT High Speed Semi Automatic Dicing Machine for Production Line
Case Sharing
SMT High Speed Semi Automatic Dicing Machine for Production Line SMT High Speed Semi Automatic Dicing Machine for Production Line
Optional Equipment
  • Blade damage detection function
  • Automatic setting function
  • Dicing visual function
  • 3-inch dicing blade compatibility
SMT High Speed Semi Automatic Dicing Machine for Production Line
Platform Capacity Comparison
Standard 8-inch working platforms accommodate only 2 pieces of material. The SDS1000/ADS2000 models feature 12-inch chucks capable of holding 4 pieces per cycle, reducing loading times, accommodating larger products, and improving efficiency by over 8%.
SMT High Speed Semi Automatic Dicing Machine for Production Line
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SMT High Speed Semi Automatic Dicing Machine for Production Line

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Product Detail
Place of Origin :
Guangdong, China
Brand Name :
YUSH
MOQ :
1 set
Price :
$19,000-22,000 / set
Weight :
850 kg
Power :
10 kW
Contact Supplier
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line
SMT High Speed Semi Automatic Dicing Machine for Production Line

YUSH Electronic Technology Co.,Ltd

Verified Supplier
12 Years
jiangsu, suzhou
Since 2005
Business Type :
Manufacturer
Main Products :
PCB Depaneling Machine, PCB Depaneling Router, PCB Separator
Total Annual :
10000-50000
Employee Number :
1000~2000
Certification Level :
Verified Supplier
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