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Automatic PCB Copper Electral Plating Production Line
Automatic PCB Copper Electral Plating Production Line
Specifications
Description

Process Flow:

Coarse grinding→Expansion→Desmear→Three-Stage Washing→Neutralization→Second-Stage Washing→Degreasing→Dilute Pickling→Second-Stage Sashing→Micro-Etching→Pre-Soaking→Activation→Second-Stage Washing→Accelerating→First-Stage Washing→Sinking Copper→Secondary Washing→Plate Surface Plating→Small Grinding→Copper Inspection


Origin: China

Maximum Board Size:610mm X 1100mm

Board Thickness: 0.2-6.0mm

Maximum Copper Thickness: 12oz

Minimum Mechanical Aperture: 0.15mm

Number of Layers: 2-30 L

Minimum Line Width & Spacing: 3/3mil

Impedance Control: +/-10%

Maximum Plate Thickness Aperture Ratio: 10:01

Automatic PCB Copper Electral Plating Production Line


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Automatic PCB Copper Electral Plating Production Line

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Automatic PCB Copper Electral Plating Production Line

Terrene Trading Limited

Verified Supplier
1 Years
shenzhen
Since 2014
Business Type :
Distributor/Wholesaler, Agent, Exporter, Trading Company, Seller
Main Products :
PCB Manufacturing Plant, PCB Milling Machine, PCB Drilling Machine
Total Annual :
1000000-5000000
Employee Number :
50~100
Certification Level :
Verified Supplier
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