Advanced electronics demand advanced PCB design—High-Speed Digital Interconnect (HDI), microvias, buried vias, and fine-pitch routing for the most demanding applications. Studio Electronics offers Advanced PCB Design with high-speed and HDI expertise, handling designs that push the boundaries of PCB technology. As a premier provider of PCB assembly in China, our professional PCB layout engineers specialize in HDI designs with microvias, sequential lamination, and impedance-controlled routing. We design for both performance and production, with prototypes built, tested, and shipped for customer confirmation.

Stage 1: Requirements Analysis
We review your advanced design requirements—HDI structure, high-speed interfaces, impedance control targets, and production goals.

Stage 2: Advanced Design
Our engineers create the design with HDI and high-speed expertise:

• Microvia and buried via design
• Sequential lamination stack-up
• Impedance-controlled routing
• Signal integrity analysis

Stage 3: Advanced DFM Review
Design is verified against advanced fabrication and assembly capability. HDI design rules, via structures, and material selections are optimized.

Stage 4: Prototype Build
We fabricate 5-10 sample boards and assemble them on our 12 automated SMT lines with ±25μm accuracy.

Stage 5: Validation & Customer Approval
Prototypes undergo AOI, X-Ray, ICT, and functional testing. Samples are shipped for your confirmation.

• Technology Leadership – Capability for the most advanced designs
• Performance – High-speed and HDI for demanding applications
• Signal Integrity – Impedance-controlled routing ensures performance
• Manufacturable – DFM principles for advanced technology
• Low Volume Support – Advanced design for low volume PCB assembly

Studio delivers Advanced PCB Design—high-speed and HDI expertise for the most demanding applications.