SMT Chip Processing DIP Soldering Video Surveillance Terminal Motherboard
Product parameters
| SMT (Surface-Mount Technology) |
THD (Thru-Hole Device) |
SMT & THD mixed |
Double sided SMT and THD assembly |
| PCB layer: 1-32 layers; |
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards; |
Board type: Rigid FR-4, Rigid-Flex boards |
PCB thickness: 0.2mm-7.0mm; |
PCB dimension width: 40-500mm; |
Copper thickness: Min:0.5oz; Max: 4.0oz; |
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm; |
Component size: 0.6*0.3mm-33.5*33.5mm; |
Component height: 6mm(max); |
Pin spacing laser recognition over 0.65mm; |
High resolution VCS 0.25mm; |
BGA spherical distance: ≥0.25mm; |
BGA Globe distance: ≥0.25mm; |
BGA ball diameter: ≥0.1mm; |
IC foot distance: ≥0.2mm; |
| SMT (Surface-Mount Technology) |
THD (Thru-Hole Device) |
SMT & THD mixed |
Double sided SMT and THD assembly |
| PCB layer: 1-32 layers; |
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards; |
Board type: Rigid FR-4, Rigid-Flex boards |
PCB thickness: 0.2mm-7.0mm; |
PCB dimension width: 40-500mm; |
Copper thickness: Min:0.5oz; Max: 4.0oz; |
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm; |
Component size: 0.6*0.3mm-33.5*33.5mm; |
Component height: 6mm(max); |
Pin spacing laser recognition over 0.65mm; |
High resolution VCS 0.25mm; |
BGA spherical distance: ≥0.25mm; |
BGA Globe distance: ≥0.25mm; |
BGA ball diameter: ≥0.1mm; |
IC foot distance: ≥0.2mm; |
| SMT (Surface-Mount Technology) |
THD (Thru-Hole Device) |
SMT & THD mixed |
Double sided SMT and THD assembly |
| PCB layer: 1-32 layers; |
PCB material: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum Boards; |
Board type: Rigid FR-4, Rigid-Flex boards |
PCB thickness: 0.2mm-7.0mm; |
PCB dimension width: 40-500mm; |
Copper thickness: Min:0.5oz; Max: 4.0oz; |
Chip accuracy: laser recognition ±0.05mm; image recognition ±0.03mm; |
Component size: 0.6*0.3mm-33.5*33.5mm; |
Component height: 6mm(max); |
Pin spacing laser recognition over 0.65mm; |
High resolution VCS 0.25mm; |
BGA spherical distance: ≥0.25mm; |
BGA Globe distance: ≥0.25mm; |
BGA ball diameter: ≥0.1mm; |
IC foot distance: ≥0.2mm; |



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Traceability system
Fully automatic FCT testing
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Sales personnel with a bachelor's degree or above