

| 1 | Layers | Muti layer |
| 2 | Substrate | FR4+PI |
| 3 | Board thick | 1.8mm |
| 4 | App | Automobile |
| 5 | Surface treat | ENIG 3u'' |
| 6 | Hole tolerance | PTH:±3mil, Non-PTH:±2 mil |
| 7 | Min hole | 0.075mm |
| 8 | Min line width | 3mil |
| 9 | Min gap | 3mil |
| 10 | Cu thickness | 105um |
| 11 | Soldermask | Green |
| 12 | Impedance control | ±10% |
| 13 | Legend | White |
| 14 | Certificates | TS16949,ISO9001/14001,UL,RoHS,SGS |
| 15 | Production capacity | 60000 sqm/month |
Quality control flow:
