1 | Layers | Muti layer |
2 | Substrate | FR4+PI |
3 | Board thick | 1.8mm |
4 | App | Automobile |
5 | Surface treat | ENIG 3u'' |
6 | Hole tolerance | PTH:±3mil, Non-PTH:±2 mil |
7 | Min hole | 0.075mm |
8 | Min line width | 3mil |
9 | Min gap | 3mil |
10 | Cu thickness | 105um |
11 | Soldermask | Green |
12 | Impedance control | ±10% |
13 | Legend | White |
14 | Certificates | TS16949,ISO9001/14001,UL,RoHS,SGS |
15 | Production capacity | 60000 sqm/month |
Quality control flow: