1. 10 layer board.
 
 2. FR4 Tg170 material.
 
 3. blind via resin hole + plating filled,Buried via,Pads over via.
 
 4. Control system usage.
 
 5. 0.078mm line track and space.
 
 
 
| 1 | Layers | 10L | 
| 2 | Material | FR4 Tg170 | 
| 3 | Board thick | 1.58mm | 
| 4 | App | Control system | 
| 5 | Min hole | 0.1mm | 
| 6 | Min line copper | 0.078mm | 
| 7 | Min gap | 0.078mm | 
| 8 | Surface finish | Immersion gold 2u'' | 
| 9 | Cu thickness | 1OZ | 
| 10 | Solder resist | Blue LPI | 
| 11 | Blind via | Have | 
| 12 | Buried via | Have | 
| 13 | Pads over via | Have | 
| 14 | Certs | UL,ISO16949,RoHS compliant,ISO9001/14001,SGS | 
FAQ
Q1:HDI means?
 A: High density Interconnect.
Q2:HDI summary?
 A: PCB with a higher wiring density per unit area than conventional board,They have finer line and space<=0.1mm,smaller via(<=0.15mm) and capture pad<=0.4mm, and higher connection paddensity(>20pads/cm2) than conventional board.
Q3:What about quality assurance?
 A: As for HDI board,We must ensure 100% test ok then delivery.
Q4: What about leadtime?
 A: Normally 20 working days production time for HDI boards.
Q5: Where's your clients?
 A: America,Europe,India,Southeast Asia etc.
  
Plant overview:

