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Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface
Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface
Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface
Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface
Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface
Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface
Specifications
Brand Name :
OEM and ODM
Model Number :
SL81104S08
Certification :
UL,RoHS, CE
Place of Origin :
China
MOQ :
1pc
Price :
Negotiable
Payment Terms :
T/T, Western Union, MoneyGram,Paypal
Supply Ability :
10000pcs per day
Delivery Time :
5-7 days
Packaging Details :
ESD package
Number of layer :
4-18 layers
Surface :
Immersion gold
Material :
94v0 FR4
Features 1 :
Gerber/PCB file needed
Features 2 :
100% E-test
Features 3 :
Quality 2 years guarantee
Description

Thick gold PCB Prototype multilayers PCB Rohs 94v0 high complexity PCB

Advantages

- No MOQ

- OEM services provided

- Heavy copper PCB, Heavy gold PCB, Blind / Buried via PCB, High layer count PCB manufacturable

- Factory direct price

- Replying with price in one working day

- Shipping within 24 hours

- Certificate: ROHS, UL, ISO9001-2000, ISO14001,SGS Lead-Free

PCB General Capability

Number of Layer

1 - 18 Layer

Maximum Processing Area

680 × 1000MM

Min Board Thickness

2 Layer - 0.3MM ( 12 mil )

4 Layer - 0.4MM ( 16 mil )

6 Layer - 0.8MM ( 32 mil )

8 Layer - 1.0MM ( 40 mil)

10 Layer - 1.1MM ( 44 mil )

12 Layer - 1.3MM ( 52 mil )

14 Layer - 1.5MM ( 59 mil )

16 Layer - 1.6MM ( 63 mil )

18 Layer - 1.8MM ( 71 mil )

Finished Board Thickness Tolerance

Thickness ≤ 1.0MM, Tolerance: ± 0.1MM

1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%

Twisting and Bending

≤ 0.75%, Min: 0.5%

Range of TG

130 - 215 ℃

Impedance Tolerance

± 10%, Min: ± 5%

Hi-Pot Test

Max: 4000V/10MA/60S

Surface Treatment

HASL, With Lead, HASL Free Lead

Flash Gold, Immersion Gold

Immersion Silver, Immersion Tin

Gold Finger, OSP

PCB Capacity

Item
Capability---Technology
Standard
IPC-A-610 E Class II-III
Laminate/Base Material
FR-4 / PI (FPC) / High TG FR-4 / Halogen Free material/Rogers/Arlon/
Taconic/Teflon/CEM-3/PTFE/Aluminum /BT
Layers
1-18
Finised inner/outer copper thickness
1-6 OZ
Board Thinkness
0.2-5.0mm
Min hole size
Mechanical hole: 0.15mm
Laser hole: 0.1mm
Min line width/space
0.075mm/0.075mm
Min line Gap
+/-10%
Aspect Ratio
12:1
Controlled Impedance
<= +/-10%
Solder Mask Color
Green,Blue,Black,White,Yellow,Red,Grey,Purple etc..
Outline profile
Rout/ V-cut/ Bridge/ Stamp hole
Surface treatment
HASL, HASL lead free, Immersion Gold,ENEPIG, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP...
Tolerance of dimension size
+/-0.1mm
Capacity
35000sq/Month
CAM Capability
40 item

PCB Photos

Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold SurfaceThick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface

Product tags

four layer immersion gold pcb

,

6 layers immersion gold pcb

,

immersion gold multilayer pcb
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Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface

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Product Detail
Brand Name :
OEM and ODM
Model Number :
SL81104S08
Certification :
UL,RoHS, CE
Place of Origin :
China
MOQ :
1pc
Price :
Negotiable
Contact Supplier
Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface
Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface
Thick Gold PCB Prototype Multilayers Rohs 94v0 High Complexity Immersion Gold Surface

Shenzhen Shinelink Technology Ltd

Active Member
8 Years
guangdong, shenzhen
Since 2005
Business Type :
Manufacturer, Trading Company
Main Products :
PCBA Board, Turnkey PCB Assembly, LED PCB Assembly
Total Annual :
8 million-10 million
Employee Number :
250~300
Certification Level :
Active Member
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