HDI PCB Fabrication
Aug 21, 2025
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Product Description: Fr4 Copper Clad Laminate Multilayer HDI 1.0mm PCB For Mobile Phone Quick detail: Material:Fr4 Layer:4 Surface finish:immersion gold Copper weight:1oz Board size:4.5*3cm Total thickness:1.6mm Min line ...learn more
HDI PCB Fabrication 1.0mm FR4 Multilayer Circuit Board

HDI PCB Fabrication 1.0mm FR4 Multilayer Circuit Board
1000000000pcs/mon
USD0.1-1000
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ONESEINE TECHNOLOGY CO.,LTD

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