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High Frequency 2 Layer Communication PCB 1OZ 35um
High Frequency 2 Layer Communication PCB 1OZ 35um
Specifications
Place of Origin :
Shenzhen,China
Brand Name :
ONESEINE
Certification :
ISO9001,ISO14001
Model Number :
ONE-102
MOQ :
1pcs
Price :
USD0.1-1000
Packaging Details :
Vacuun bag
Delivery Time :
5-8 working days
Payment Terms :
T/T,Western Union
Supply Ability :
1000000000pcs/mon
product_type :
Communication PCB
material :
High Frequency
layer_count :
2 layer
copper_weight :
1OZ
Min Line Width :
4mil
Mechanical Rigid :
Rigid
Feature :
Batch Customized Production
Copper Weight :
35um
Description

High Frequency Communication PCB Board Handling

PCB description:

Application Products: Power Amplifier

Number of layers: 2

Surface treatment: OSP

Material: ptfe f4b

PCB size:180*50mm

Outer line width/line spacing: 7/7mil

Inner line width/line spacing: 5/5mil

Board thickness: 2.3mm

Minimum aperture: 0.6mm

Precision High-Frequency PCBs for Mission-Critical Communication Systems

Demanding signal integrity in 5G, RF, and satellite applications? As your dedicated High Frequency PCB Factory, we specialize in manufacturing 1OZ copper Communication PCB Circuit Boards engineered for GHz+ performance.

Why Our PCBs Dominate Critical Communication Hardware:
✅ Ultra-Low Signal Loss: Rogers/Taconic laminates with Dk=2.0-10.6 & controlled ±1.5% impedance tolerance
✅ 1OZ Heavy-Copper Advantage: Enhanced current handling + thermal management for power amplifiers and base stations
✅ Strict Handling Protocols: ESD-controlled environment | Vacuum-sealed packaging | Moisture-sensitive component (MSD) compliance
✅ High-Frequency Expertise: 40+ layer builds | PTFE substrates | Laser-drilled microvias down to 0.1mm
✅ Rigorous Testing: TDR analysis | Insertion loss measurements | Time-domain reflectometry

Applications We Enable:
• 5G NR mmWave Antenna Arrays
• Satellite Communication Terminals
• Radar and Avionics Systems
• High-Speed Backplane Interconnects
• IoT Gateway RF Modules

Certified Reliability:
ITAR Registered | ISO 9001:2015 | IPC-6012 Class 3 | RoHS 3.0 Compliant

Via Design: Vias can impact signal integrity at high frequencies. High-frequency PCBs may use techniques like back drilling or buried vias to minimize signal reflections and maintain signal integrity across layers.
Component Placement: Careful consideration is given to component placement to minimize signal path lengths, reduce parasitic capacitance and inductance, and optimize signal flow.
Shielding: To minimize electromagnetic interference (EMI) and RF leakage, high-frequency PCBs may employ shielding techniques such as copper pours, ground planes, or metal shielding cans.
High-frequency PCBs find applications in various industries, including wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission.
Designing and manufacturing high-frequency PCBs require specialized skills, knowledge, and simulation tools to ensure the desired performance at high frequencies. It is often recommended to work with experienced PCB designers and manufacturers who specialize in high-frequency applications.
High Frequency 2 Layer Communication PCB 1OZ 35um
High Frequency 2 Layer Communication PCB 1OZ 35um
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High Frequency 2 Layer Communication PCB 1OZ 35um

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Product Detail
Place of Origin :
Shenzhen,China
Brand Name :
ONESEINE
Certification :
ISO9001,ISO14001
Model Number :
ONE-102
MOQ :
1pcs
Price :
USD0.1-1000
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High Frequency 2 Layer Communication PCB 1OZ 35um

ONESEINE TECHNOLOGY CO.,LTD

Verified Supplier
1 Years
foshan
Since 2013
Business Type :
Manufacturer
Main Products :
HF PCB, Rogers PCB Board, Multilayer PCB Board
Total Annual :
1000000-5000000
Employee Number :
100~200
Certification Level :
Verified Supplier
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