Full-Scale PCB Assembly Solutions for Complex Circuit Boards

General PCBA Information:

Base material:FR4 epoxy resin

Board thickness:1.6mm

Surface finish:Immersion gold

Board size:7.2*17.3CM

Copper thickness:1OZ

Solder mask and silkscreen: green and white

Components sourcing:yes

Technical requirement for pcb assembly:

1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603,0402,0201 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.

Our PCBA Capability

SMT, PTH, mixed technology

SMT: 2,000,000 solder joints per day

DIP: 300,000 joints per day

Ultra fine pitch, QFP, BGA, μBGA, CBGA

Advanced SMT assembly

Automated insertion of PTH (axial, radial, dip)

Cleanable, aqueous and lead-free processing

RF manufacturing expertise

Peripheral process capabilities

Press fit back planes & mid planes

Device programming

Automated conformal coating

For E-Test

Universal Tester

Flying Probe Open/Short Tester

High power Microscope

Solder ability Testing Kit

Peel Strength tester

High Volt Open & Short tester

Cross Section Molding Kit With Polisher

Quote requirement for pcb and pcb assembly:

1)Gerber file and Bom list Gerber file,PCB file,Eagle file or CAD file all acceptable
2)Clear pics of pcba or pcba sample for us This will help a lot for the fast purchasing as request
3)Test method for PCBA This can guarantee 100% good quality products when delivered

Assembly Capabilities

· Printed Circuit Board Assembly (PCBA)

· Through Hole

· Surface Mount (SMT)

· PCB Handling up to 400mm x 500mm

· RoHS Compliance Production

· Non RoHS Production – where permitted

· AOI

Component Technologies

· Passive Down to 0201 size

· BGA and VFBGA

· Leadless Chip Carriers/CSP

· Fine Pitch to 0.8mils

· BGA Repair and Reball

· Part Removal and Replacement

Your End-to-End PCB Assembly Solution for Demanding Circuit Boards

Today’s innovations demand circuit boards that push the boundaries: dense multilayer designs, intricate HDI layouts, advanced RF components, and ultra-fine-pitch BGAs. If your project involves complex PCB assembly, partnering with a manufacturer equipped for the challenge isn't just beneficial – it's critical for success.

Why "Standard" Assembly Falls Short for Complex Boards:
Complex PCBs introduce unique hurdles that generic assemblers often struggle with:

Microscopic Precision: Placing 01005 components or 0.3mm pitch BGAs requires advanced equipment and meticulous process control.

Advanced Materials: Handling high-frequency laminates (Rogers, Taconic) or heavy copper boards demands specialized expertise.

Intricate Layer Stacks: Managing 20+ layers, blind/buried vias, via-in-pad, and impedance control needs deep engineering collaboration.

Demanding Technologies: Integrating mixed-signal designs, embedded components, RF shielding, and strict thermal management requires proven capability.

Supply Chain Agility: Securing specialized, long-lead, or obsolete components for complex BOMs is a constant battle.